Ultrasonic flip chip bonder
A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.
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basic information
A compact tabletop flip chip bonder for gold bump bonding using ultrasonic (lateral vibration) joining method. It can accommodate a wide range of applications from mass production for various products to process and material development.
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Applications/Examples of results
Features ● The special optical lighting unit makes it easy to detect substrate patterns and IC alignment marks. ● The chip flipping mechanism allows for bonding of chips stored face-up in the tray. ● The ultrasonic process control software enables easy bonding.
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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