Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.

Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.