【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Wafer processing/polishing equipment
• Bonding Equipment

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

Central Science Co., Ltd. will be exhibiting in the Process Inspection and Measurement Zone at the "27th Interphex Week Tokyo" held at Tokyo Big Sight. At our booth, we will focus on products under the Sievers brand, showcasing measuring instruments used for pharmaceutical water management. - Products to be displayed: "Online TOC Analyzer Sievers M500" "Laboratory TOC Analyzer Sievers M9" "Endotoxin Analyzer Sievers Eclipse" "Bio-Burden Rapid Analysis Device Sievers Soleil," among others. Additionally, we plan to hold a seminar at the exhibitor seminar venue on the theme "How to streamline manufacturing processes while ensuring the quality of pharmaceutical water?" We sincerely look forward to your visit.

We are pleased to offer everyone the opportunity to view Foss analysis equipment at Foss Japan. In this open house, we aim to provide information to a wide audience, including tips for selecting analysis equipment and ways to further utilize the equipment you are currently using. We have planned a comprehensive seminar for those who wish to deepen their knowledge about future analysis, as well as for those seeking information on selecting analysis equipment. Additionally, we will have various NIR devices on display, and it will be possible to measure samples you bring with you. Of course, we also welcome visitors who only wish to tour the equipment! We sincerely look forward to your participation. ■ Date: June 18, 2026 (Thursday) 11:00 AM – 4:30 PM (Reception starts at 10:45 AM) ■ Venue: Kobe International Conference Center, Seminar House Room 702 / Some online participation available ■ Overview: - Greetings and introduction of Foss product lineup *Online participation available - Basics of NIR and selecting the optimal model *Online participation available - Demonstration of calibration software FossCalibrator: Let's create a calibration curve *On-site only - Sample measurement and open house *On-site only For more details, please check the PDF.

**Exhibition Content** Streamlining Software Development in the SDV Ecosystem In this exhibition, we will introduce comprehensive solutions for the arrival of the Software Defined Vehicle (SDV) era. As the value of automobiles shifts from hardware to software, there is a growing demand for balancing development efficiency and quality. Our services, which leverage advanced technologies and know-how based on our extensive track record, will strongly support your SDV development: - SDV Total Solution: An integrated approach to optimize the entire vehicle system - SDV Safety Integration: Development processes and verification techniques compliant with functional safety standards - Streamlining Software Development with Generative AI: Code generation and test automation utilizing the latest AI technologies - Integrated Simulation Environment Construction Solutions: Building an efficient development environment by linking multiple simulation tools - Simulink Model Guideline Check Tool "Model Dr. MDiA": Automatically verifying model quality to improve development efficiency and quality

On Tuesday, April 21, at Iidabashi, paperlogic will have a booth at "Canon Selection 2026." The theme of this event is "Paper Output × Data Utilization." It is a comprehensive exhibition filled with hints to promote DX in the office and achieve operational efficiency. At the venue, there will be the latest "Security Measures Seminar" to protect companies from supply chain attacks, as well as programs like creating promotional flyers that anyone can make, "Super Easy! PDF Utilization Techniques" to alleviate daily frustrations, and "Paperless Fax Experience" to support remote work, all aimed at solving on-site challenges. From paperlogic, we will introduce the 【paperlogic Electronic Contract】 as a solution for "Document Management and Back Office Digitization." We will have actual operation demonstrations at our booth and will directly address your concerns regarding document management. We also have special plans exclusively for Otsuka Corporation, so please come and visit us.

We will be holding a technical training session for MilkoScanFT3 as detailed below. In this training, we will provide a broad range of information useful for operating the equipment, including explanations of the principles and structure of the device, how to create measurement products, daily maintenance, and responses to troubleshooting. Additionally, this year we will introduce new ways to utilize digital services (such as FossCalibrator and IQX), and we have also prepared hands-on sessions where customers can experience operating the equipment using a PC. The training content is designed to be more practical and immediately applicable in real-world settings. We understand you may be busy, but we kindly ask you to consider participating. ■ Osaka Venue: June 25-26 ■ Morioka Venue: July 8-9 ■ Tokyo Venue: August 27-28 ■ Obihiro Venue: September 17-18 ■ Fukuoka Venue: October 8-9 *Please check the PDF for more details.