【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Wafer processing/polishing equipment
• Bonding Equipment

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

【Seminar Overview】 The construction industry faces many challenges, including labor shortages, regulations on working hours, and the need for operational efficiency. Additionally, the aging workforce presents significant issues, and there is a concerning trend of high turnover rates among younger employees who are supposed to carry on the skills and knowledge. In this seminar, we will discuss the causes of turnover based on case studies and explain key points on how advancing IT can help reduce turnover rates.

Date: October 7, 2025 (Tuesday) to October 10, 2025 (Friday) - 4 days Opening Hours: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Halls 4-8 Booth Number: 7-126 Exhibited Machines: ■ Quantitative Molding → Deep Drawing Automatic Feeding Line VEMAG (Germany) Robot500 ... Quantitative Filling Machine VEMAG (Germany) ASV811 ... Cutting Device FANUC (Japan) Parallel Link Robot SEALPAC (Germany) RE23 ... Deep Drawing Vacuum Gas Replacement Packaging Machine FANUC (Japan) Collaborative Robot SMC (Japan) Hand ■ SEALPAC (Germany) Amax ... Fully Automatic Gas Replacement Tray Sealer * Digital Printing Top Film Videojet (Japan) UV Laser Marker Nikka Densok (Japan) Seal Leak Testing Device M-flex ... Semi-Automatic Rotating Gas Replacement Tray Sealer ■ Supervac (Austria) GK169B ... Belt-Type Chamber Machine GK402B ... Belt-Type Chamber Machine ■ Packaging Materials Hotel Pantry * Please note that the exhibited machines may change without prior notice.

【Exhibition Information】 Exhibition Name: Food Processing Technology Expo 2025 Date and Time: November 14, 2025 (Friday) 10:30 AM - 4:30 PM *Free entry and exit, pre-registration required Location: Osaka Industry Creation Center - We will showcase technical products using the factory deodorant "Deofure." - We will display the tofu defoamer "Tofu Up." - Other aromatic technical products will also be exhibited. *For more details, please refer to the materials.

Techne Measurement Co., Ltd. will exhibit at the "Kyushu Semiconductor Industry Exhibition" held at Marine Messe Fukuoka, Halls A and B, on October 8 (Wednesday) and 9 (Thursday), 2025. This time, we will showcase dew point meters, moisture meters, oxygen concentration meters, anemometers, temperature and humidity meters, and temperature and humidity/dew point calibrators for the semiconductor industry. Please be sure to visit the Techne Measurement booth. 　＿＿＿　　　　　　　＿＿＿ 　＼ ┌┴──────┴┐ ／ 　／ │Visitor Gifts│ ＼ 　￣ └────────┘ ￣ 　　 We are giving away the very popular 330ml spherical bottle of cute "Moisture Water"! Visitors who exchange business cards will receive water in the shape of our official character "Moisture" as a gift♪ It's a very cute bottle, so be sure to get one! Please be sure to visit the Techne Measurement booth.