【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

• Wafer processing/polishing equipment
• Bonding Equipment

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

• Wafer processing/polishing equipment
• Bonding Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

We will introduce a case study of a poka-yoke measure that integrates the inspection of the screw tightening process in assembly work with an electric screwdriver and the work inspection camera "RICOH SC-20." This time, we will provide a detailed explanation of the operational method for screw tightening work inspection achieved by combining the Panasonic AC screwdriver "Azeloss (Type A)" with its control device. This content is sure to provide hints for solving challenges in your workplace. We encourage you to take this opportunity to watch.

We are pleased to announce that we will be exhibiting at 'BATTERY JAPAN' held at Tokyo Big Sight from March 17 (Tuesday) to March 19 (Thursday), 2026. At our booth, we will be showcasing the following products: 【Details of Exhibited Products】 ■ Precision Gear Pumps - Metering pumps suitable for high pressure, low viscosity, and high viscosity applications. ■ Gear Pump Coating Equipment - High-precision coating equipment suitable for high-viscosity materials such as adhesives. ■ Inline Viscometers - Two types of inline viscometers that enable continuous monitoring of viscosity. Additionally, we offer inline viscometers that can display viscosity in real-time, proposals for cleaning and maintenance tailored to materials and resins, and various tests related to fluid delivery and coating, all tailored to meet our customers' needs. We invite you to visit our booth. We look forward to welcoming you all.

Woyou Paper Co., Ltd. will be exhibiting at the 1st Mobility Material Exhibition [Nagoya] MOBIMA, which will be held starting tomorrow as part of the 1st High-Performance Material Week. This time, we will showcase three newly developed products announced last year, along with BIOSHADE (marine organism adhesion prevention film). - Millimeter-wave compatible ultra-wideband electromagnetic wave absorption sheet (developed product) - Dielectric elastomer (developed product) - Seaweed bed creation sheet (developed product) - BIOSHADE (Bio Shade) Additionally, we will also display various processed products under the themes of "prototype support," "contract manufacturing," and "environmental response." If you have any concerns regarding the development of your film materials, BCP response for production items, securing capacity, or switching to biomass materials, please feel free to consult us at our booth. Event Name: 1st Mobility Material Exhibition [Nagoya] MOBIMA within High-Performance Material WEEK Dates: February 18 (Wednesday) to 20 (Friday), 10:00 AM to 5:00 PM Exhibition URL: https://www.material-expo.jp/nagoya/ja-jp/visit/mobima.html