ズース・マイクロテック List of News Articles

On June 22, 2018 (Friday), I will give a presentation titled "Latest Trends in Temporary Bonding and Debonding Technology for FO-WLP" at the Science & Technology Company seminar "Changing Semiconductor Packaging." 1. Application of Temporary Bonding/Debonding Technology to FO-WLP 1.1 Background of Temporary Bonding/Debonding Technology 1.2 Applications of Temporary Bonding/Debonding Technology 1.3 Basic Processes of 2.5D/3D Stacking 1.4 Basic Processes of FO-WLP 2. XBS300 Bonding Equipment 2.1 XBS300 Platform 2.2 Support for Warped Wafer Transport 3. XBC300 Gen2 Debonding and Cleaning Equipment 3.1 XBC300 Gen2 Platform 3.2 Mechanical Debonding 3.3 Laser Debonding 3.4 Cleaning Equipment Compatible with Tape Frames 3.5 Detaper 4. Conclusion 5. Q&A Session

We will be exhibiting at the MEMS Engineer Forum 2018 (April 25 (Wed), 26 (Thu); KFC Hall (Tokyo, Ryogoku)). We look forward to your visit.

We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.