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  1. Home
  2. Electronic Components and Semiconductors
  3. ズース・マイクロテック
  4. [Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
SEMINAR_EVENT
  • Feb 19, 2018
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Feb 19, 2018

[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).

ズース・マイクロテック ズース・マイクロテック
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
Fully Automatic Wafer Bonder XBS200
Fully Automatic Wafer Bonder XBS200
Date and time Tuesday, Apr 17, 2018 ~ Saturday, Apr 21, 2018
Capital Hotel Hanamizuki
Entry fee Charge
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Related product

XB8_MG_7900 frei rgb_Original_5395.jpg

High-Load Wafer Bonder XB8

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

  • Wafer processing/polishing equipment
  • Bonding Equipment

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SB8Gen2_photo.jpg

Universal Wafer Bonding Device SB6/8 Gen2

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

  • Other processing machines

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Wafer Detachment Device DB12T

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

  • Wafer processing/polishing equipment
  • Bonding Equipment

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ズース・マイクロテック
Electronic Components and Semiconductors
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We will be exhibiting at the Agriculture WEEK/Plant Factory EXPO from October 1st to 3rd.

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  • SEMINAR_EVENT

We will be exhibiting from Wednesday, October 1 to Friday, October 3, 2025. Makuhari Messe https://www.jagri-global.jp/hub/ja-jp/visit/feature-t/plant.html Please stop by!

Jul 01, 2026

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How Will Drawings, Sites, and Documents Change? The Reality of AI Implementation That Construction and Civil Engineering Companies Need to Know Right Now in 45 Minutes

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  • SEMINAR_EVENT

To construction and civil engineering companies looking for the "next" step in digitalization. This seminar will explain the currently trending topic of "AI utilization" in 45 minutes. We will clearly introduce the latest trends, specific case studies, and steps for implementation to address questions such as "What can AI do?" and "How can it be applied to our business?" Whether your company is already advancing in DX or is just starting to consider AI, you will find hints for improving operational efficiency. 【Schedule】 1: Company introduction and instructor introduction 2: Case studies of AI utilization in the construction and civil engineering industry 3: Convincing examples! Patterns of AI utilization in construction operations 4: Three steps to avoid failure in AI implementation 5: Q&A and closing remarks

Jul 01, 2026

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Digitalizing the veteran's expertise! Techniques for sharing know-how to enable young professionals to operate independently.

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  • SEMINAR_EVENT

We will address the issue of young employees who, despite joining the company, leave due to reasons such as "there's no time to be taught," "I don't understand when I'm told to learn by watching," and "what is written and said varies depending on the project or person in charge." We propose a system that accumulates the know-how of veterans in AI and systems, allowing young employees to search for and solve problems on their own. 【Schedule】 1: Company introduction and instructor introduction 2: Reasons why technical inheritance is not progressing (lack of time, difficulty in verbalizing) 3: "Next-generation manual and know-how sharing methods" utilizing video and AI search 4: Examples of system construction to institutionalize technical inheritance 5: Q&A and closing remarks

Jul 01, 2026

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[Seminar] Market and Regulatory Trends of Domestic Battery Storage Business and Business Points 2026

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  • SEMINAR_EVENT

[Speaker] Kentarou Kobe, Senior Consultant Mitsubishi Research Institute, Inc. Power and Energy Division Demand Side Innovation Group [Key Lecture Content] As we strive for carbon neutrality, the importance of stationary storage batteries that support the expansion of renewable energy adoption and the stabilization of electricity supply and demand is increasing. On the other hand, the environment surrounding the battery storage business is undergoing significant changes, including the review of electricity markets and systems, increased renewable energy output control, expanded utilization of demand-side resources, grid connection, cell procurement, cybersecurity, and regional coexistence. In this lecture, we will organize the values required for future battery storage businesses from four perspectives: power system value, renewable energy value, consumer value, and regional value. Based on this, we will introduce points for consideration in business development, focusing on grid-connected and renewable energy co-located systems, taking into account the characteristics of each type. [Lecture Items] 1. Current status of the domestic battery storage market and the future image of battery storage required 2. Market and system trends surrounding grid-connected battery storage and key points 3. Market and system trends surrounding renewable energy co-located battery storage and key points 4. Points for consideration in battery storage businesses that provide multiple values 5. Summary 6. Q&A / Business card exchange

Jul 01, 2026

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[Seminar] New Industry Map of the 6G Era

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  • SEMINAR_EVENT

[Lecturers] Accenture Ltd. Industry & Enterprise Headquarters Managing Director Yuya Horiguchi, Head of Telecommunications and Media Practice Japan Senior Manager Mamoru Yonemura, Digital Core Strategy [Key Lecture Content] This presentation will analyze the next structure of the telecommunications industry from the perspective of investment and business strategy regarding 6G. As standardization intensifies in preparation for commercialization around 2030, there is also strong caution that we may "repeat the same mistakes as with 5G." Starting from environmental changes that could not be anticipated in 2020, such as the expansion of generative AI demand, commercialization of NTN (satellite communications), data sovereignty, and power/supply constraints, we will organize the points of discussion on infrastructure investment, business restructuring, sharing, and monetization. From the standpoint of connecting enterprise demand with telecommunications infrastructure, we will present the investment decisions that telecommunications operators should make and the materials for their next steps.

Jul 01, 2026

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