Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.
【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.
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basic information
The SB6/8 Gen2 is a semi-automatic platform that supports a variety of bonding processes and can handle various sizes and types of wafers and substrates up to 200mm, making it a flexible tool suitable for diverse applications and process environments. It is used in a wide range of fields, including device fabrication for MEMS, LEDs, advanced packaging, and 2.5D/3D stacking, as well as wafer-level packaging. With the SB6/8 Gen2, the transition from research and development to pilot production and then to mass production can be carried out smoothly. □ For more details, please refer to the catalog.
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Company information
Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.
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