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  1. Home
  2. Electronic Components and Semiconductors
  3. ズース・マイクロテック
  4. 【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).
SEMINAR_EVENT
  • Feb 19, 2018
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Feb 19, 2018

【Ended】We will be exhibiting at the MEMS Engineer Forum 2018 (April 25-26, KFC Hall, Ryogoku, Tokyo).

ズース・マイクロテック ズース・マイクロテック
We will be exhibiting at the MEMS Engineer Forum 2018 (April 25 (Wed), 26 (Thu); KFC Hall (Tokyo, Ryogoku)). We look forward to your visit.
Fully Automatic Wafer Bonder XBS200
Fully Automatic Wafer Bonder XBS200
Date and time Wednesday, Apr 25, 2018 ~ Thursday, Apr 26, 2018
Capital KFC Hall (Tokyo, Ryogoku)
Entry fee Free
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Related product

XB8_MG_7900 frei rgb_Original_5395.jpg

High-Load Wafer Bonder XB8

200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.

The ZUSE Microtech high-load wafer bonder XB8 is the latest wafer bonder with a maximum load of 100 kN, capable of processing various sizes and materials of wafers and substrates up to 200 mm. It flexibly accommodates various bonding processes such as metal diffusion bonding, eutectic bonding/TLP bonding, adhesive bonding, and fusion bonding, making it an ideal wafer bonder for a wide range of applications including advanced MEMS, LEDs, and 3D integration.

  • Wafer processing/polishing equipment
  • Bonding Equipment

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SB8Gen2_photo.jpg

Universal Wafer Bonding Device SB6/8 Gen2

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

  • Other processing machines

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Wafer Detachment Device DB12T

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

  • Wafer processing/polishing equipment
  • Bonding Equipment

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ズース・マイクロテック
Electronic Components and Semiconductors
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Finally, it's happening! We will be exhibiting at the "New Technology Creation Exchange 2026."

  • NEW
  • SEMINAR_EVENT

The "New Technology Creation Exchange 2026" is finally approaching! At B-Core, we will showcase our uniquely developed black-and-white code, the "BE-AR Marker." It can read many codes at once. On the day of the event, you will be able to see a demonstration of bulk reading multiple BE-AR Markers with a camera. We also welcome inquiries about various applications such as goods and inventory management, identification of equipment and objects, and AR markers, with questions like "Can it be used this way?" Please come and see the actual reading at the venue. We look forward to your visit. ◆BE-AR Marker  https://bear.b-core.net

Oct 20, 2026

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[Seminar] Identifying Mismatched Employees and Labor Management

  • NEW
  • SEMINAR_EVENT

[Speaker] Mr. Daishi Konoe, Partner Lawyer at KKM Law Office [Key Lecture Content] In recent years, due to fluctuations in the economic situation, wage increases and labor shortages have become serious issues, making it urgent for companies to figure out how to effectively utilize their existing workforce as a survival strategy. However, it cannot be denied that employees who are mismatched with the company and those who cannot fully demonstrate their abilities are lowering the operational efficiency of the business. While companies are required to implement improvement measures and build human resources aimed at placing the right people in the right positions, they may also be faced with the need to make tough decisions regarding employees. However, while companies may harbor dissatisfaction with mismatched employees, employees also have their own grievances against the company, leading to potential conflicts arising from each response made by the company. In this lecture, the speaker will discuss the responsibilities of the company regarding mismatched employees, methods for resolution, and the associated risks, focusing on four scenarios where issues are likely to arise, and will provide a wealth of case law to illustrate the nuanced examination of difficult cases.

Oct 20, 2026

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We have automated our operations! From email creation to updating management records - using AI agents.

  • NEW
  • SEMINAR_EVENT

In this seminar, we will introduce the potential of the AI agent "Tsunagi AI Powered by Dify," which connects the entire business. You will experience a realistic image of its application through examples of how we have automated our operations! ☆ Date ☆ November 1, 2026 (Sunday) to November 30, 2026 (Tuesday)   https://www.nttd-bb.com/event/smn20261101ai.html?utm_source=ipros&utm_medium=other&utm_campaign=20261015_sales ☆ Venue ☆ Online seminar, free of charge ☆ Seminar Content ☆  By using AI agents, we can achieve  【cross-organizational business automation】 that goes beyond individual efficiency!  This video will introduce the potential of the AI agent "Tsunagi AI Powered by Dify," which connects the entire business. You will experience a realistic image of its application through examples of how we have automated our operations! <Target Audience>  ・Those interested in cross-organizational business automation using AI  ・Those interested in AI and AI agents

Oct 20, 2026

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Notice of Participation in the 11th Drink Japan from November 18 (Wednesday) to November 20 (Friday), 2026

  • NEW
  • SEMINAR_EVENT

This autumn, Advantech Toyo will exhibit at the 11th Drink Japan, where the latest technologies related to beverage and food manufacturing will gather. At our booth, we will introduce filtration and analysis solutions that contribute to solving various challenges in raw materials, manufacturing processes, and quality control, including activated carbon cartridge filters for PFAS removal. We will showcase a variety of products that will be useful for beverage manufacturers, food manufacturers, and those in charge of research and development and quality control, so please take this opportunity to visit us! Additionally, on the final day of the event, we will hold a seminar for exhibitors. We invite you to stop by our booth and also participate in the exhibitor seminar!

Oct 20, 2026

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Notice of Seminar on New PFAS Removal Cartridge Filter Products on November 20, 2026 (Friday)

  • NEW
  • SEMINAR_EVENT

Advantech Toyo will introduce the new product "PFAS Removal Cartridge Filter High Flow Type" at the Drink Japan Exhibitor Seminar. As the need to address PFAS (per- and polyfluoroalkyl substances) increases, our product development team will provide a detailed explanation of the high flow type PFAS removal solution that can be utilized in manufacturing settings. In this presentation, we will discuss actual evaluation cases, the PFAS removal performance of activated carbon filters, the impact of TOC components on removal performance, and the effects of pretreatment on filter lifespan. Additionally, we will cover the high flow type designed for large volume processing and share filter technologies aimed at improving the efficiency of the filtration process in beverage manufacturing. Participants in the seminar will receive an original novelty item inspired by pH test paper rolls. If you are considering measures against PFAS or have challenges related to water treatment in beverage and food manufacturing processes, please feel free to join us!

Oct 20, 2026

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