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  1. Home
  2. Electronic Components and Semiconductors
  3. ズース・マイクロテック
  4. [Completed] JMS Seminar "Development Trends of FO-WLP - Process, Sealing, Temporary Bonding, Materials"
SEMINAR_EVENT
  • Jul 10, 2016
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Jul 10, 2016

[Completed] JMS Seminar "Development Trends of FO-WLP - Process, Sealing, Temporary Bonding, Materials"

ズース・マイクロテック ズース・マイクロテック
At the technical seminar "Development Trends of FO-WLP - Process, Sealing, Temporary Bonding, Materials" hosted by JMS (Japan Marketing Survey Co., Ltd.), I will give a presentation on the temporary bonding/peeling technology of Zeus Microtech. The seminar will provide detailed explanations on various topics, including an overview of FO-WLP, process element technologies (sealing, temporary bonding/peeling), materials, and noteworthy development technologies such as wafer scaling and application-specific deployment, addressing challenges and initiatives for future market expansion from the perspectives of semiconductor and packaging companies, equipment manufacturers, and material vendors.
Date and time Wednesday, Jul 27, 2016
10:00 AM ~ 04:30 PM
Capital Kōwa Kaikan (1-2-10 Yanagibashi, Taitō-ku, Tokyo)
Entry fee Charge 49,800 yen per person (including text and lunch)
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Related product

SB8Gen2_photo.jpg

Universal Wafer Bonding Device SB6/8 Gen2

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

  • Other processing machines

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DB12T_1804_bearb_Original_4306.jpg

Wafer Detachment Device DB12T

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

■ This is a wafer detachment device necessary for thin wafer transport/process. ■ It supports various wafer sizes from 3" to 300mm, with room temperature and mechanical wafer detachment.

  • Wafer processing/polishing equipment
  • Bonding Equipment

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ズース・マイクロテック
Electronic Components and Semiconductors
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Notice of the 21st Taste Sensor Utilization Seminar

  • NEW
  • SEMINAR_EVENT

We will be holding the highly acclaimed Taste Sensor Utilization Seminar again this year as follows. We will invite users as speakers to share actual case studies. <Overview of the Event> - Date and Time: October 9, 2026 (Friday) 13:05 - 16:30 - Format: Online (Zoom Webinar) - Participation Fee: Free - Capacity: 500 people - Speakers: Kanji Doi, Executive Director, Doctor of Agriculture, Marutomo Co., Ltd. Takayuki Suetoki, Deputy General Manager, Technical Development Department, Ariake Japan Co., Ltd. Tomono Yoshimitsu, Consulting Team, Consulting Division, Flavor and Aroma Strategy Research Institute Co., Ltd.

Sep 04, 2026

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Three Examples of Mojitori Utilization! Announcement of Archived Distribution for On-Site Improvement Seminar to Reduce Input Errors, Reporting Omissions, and Individual Dependence.

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  • SEMINAR_EVENT

We are pleased to announce the archive distribution of the seminar on the kintone plugin "Mojitori," which can read text from photos and PDFs and convert it into data. 【Three Case Studies of Mojitori Utilization! A Seminar on Improving Workplaces by Reducing Input Errors, Reporting Omissions, and Personalization】 ◆ Seminar Overview The kintone plugin "Mojitori" allows for the automatic input of text data from photos, images, and PDF files into various fields in kintone. In this seminar, we will introduce "three companies' business improvement case studies" utilizing Mojitori. We will specifically explain the challenges faced in different operations, such as label verification in manufacturing, reporting from the field, and managing client information, and why they turned to Mojitori for solutions. 【Recommended for the following individuals】 - Those who want to reduce record-keeping and transcription tasks done on paper or by hand - Those who want to prevent input errors and reporting omissions - Those who want to facilitate information sharing on kintone We hope you find hints that can be useful for your business improvement. We look forward to many participants joining us.

Sep 04, 2026

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We will be exhibiting at the Frozen, Retort, and Instant Food Ingredients Technology Exhibition from September 2 (Thursday) to September 3 (Friday), 2021.

  • NEW
  • SEMINAR_EVENT

Yamamoto Vinitar Co., Ltd. will be exhibiting at the "Frozen, Retort, and Instant Food Material Technology Exhibition" held at "Pacifico Yokohama Exhibition Hall C." Concurrently, the "2nd Nutritional Food Material Exhibition (a B to B food material exhibition focused on health and nutrition)" and the "9th P&B Japan" (a retail, baking, and confectionery exhibition) will also take place. At our booth, we will showcase a demonstration of the 'Range Type' high-frequency thawing device, along with a panel display of high-frequency thawing devices (small batch type; processing capacity of 60kg to 170kg/h, medium batch type; processing capacity of 200kg to 500kg/h, medium to large continuous type; processing capacity of 200kg to 4000kg/h) and provide a consultation desk for high-frequency and microwave heating. If you have any concerns regarding heating, drying, thawing, sterilization, secondary heating sterilization, or pest control using high-frequency/microwave technology, please visit us. [Main Examples of Thawing and Heating Processes] - Heating and drying for confectionery and baking, tempering and melting of butter, thawing of meat, pork, chicken, canned fish, squid, octopus, etc., secondary sterilization of prepared foods, and more. We look forward to your visit. [Exhibited Equipment] ■ High-frequency thawing device  ・ Range type

Sep 04, 2026

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Semicon Japan 2024

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  • SEMINAR_EVENT

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

Sep 03, 2026

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Awatori Rentaro Seminar: Understanding Stirring Methods and Heat Generation Measures According to Viscosity Through Case Studies

[10/9 Sendai] Awatori Rentaro Seminar: Understanding Stirring Methods and Heat Generation Measures According to Viscosity Through Case Studies

  • NEW
  • SEMINAR_EVENT

Do you have any of these concerns? "I want to ensure proper dispersion, but bubbles won't escape and there are inconsistencies." "It takes too long to degas using vacuum or manual methods, and the process has become reliant on specific individuals." "When mixing at high speeds, it generates heat, causing the materials to deteriorate or harden." "I want to quickly prototype and evaluate new materials or produce small quantities of various items easily." In this seminar, we will provide not only the fundamental information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials mix and the operation screen of the Shinky temperature management solution app. Additionally, we will have equipment and optional products on display in the venue, allowing you to consult while viewing the actual items. In the seminar, you will learn about: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology After the seminar, we will hold an open consultation session at the venue for anyone interested. Please register early!

Sep 03, 2026

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