Ultrasonic metal joining machine for battery laminated foil for electric bicycles
Ultrasonic Metal Welding Machine USDB-AGM 35kHz/20kHz Type
Improving the battery performance of electric bicycles, achieving high-speed and high-quality bonding.
In the electric bicycle industry, there is a demand for high-performance batteries, and the quality of electrode bonding is crucial. In particular, the reliability of the joints is essential for achieving long life and high output. Poor bonding can lead to decreased battery performance and failures. Our ultrasonic metal bonding machine enables stable bonding of battery stack foils and TAB bus bar electrodes, contributing to improved efficiency in secondary battery power extraction. 【Application Scenarios】 - Manufacturing batteries for electric bicycles - Production of high-output, long-life batteries - High-quality bonding in mass production systems 【Benefits of Implementation】 - Improved battery performance - Increased efficiency in the manufacturing process - Enhanced product reliability
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basic information
【Features】 - High-speed precision load control (original program) servo press adopted - Pressure application without air bumping or overshoot (constant pressure control) - FEM-analyzed horizontal vibration horn enabling wide width (up to 40mm) and multi-point simultaneous processing - Unique ultrasonic control method (Rinco ultrasonic oscillation control) equipped with AGM oscillator - Data communication via Ethernet/IP, also supports customization for automated machines 【Our Strengths】 UC Technology has been leading ultrasonic technology since 1966, accumulating achievements both domestically and internationally. We support customers from tool proposal and manufacturing to experimental responses.
Price information
For ultrasonic metal joining machines, ultrasonic tools (horns) and fixtures that are optimal for the customer's work are essential. Since all of these are custom-designed, pricing will be provided upon request. Regarding the main metal joining device, the optimal frequency (20kHz or 35kHz) will be selected based on the work size and joining application. Therefore, we will also respond to inquiries about the price of the main device on a case-by-case basis, so please feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Joining laminated TAB electrodes of aluminum foil, copper foil, and Ni foil for secondary batteries and capacitors ■ Joining flat wire for motor coils and aluminum terminals ■ High-pressure cable connections between copper or aluminum wire conductors and terminals ■ Joining dissimilar metals for high-pressure power lines using copper or aluminum plates ■ Joining lead terminals to power modules and DBC substrates ■ Joining of non-ferrous metals, etc. *For more details, please refer to the PDF materials or feel free to contact us.
Line up（2）
| Model number | overview |
|---|---|
| USDB-AGM20kHz-3600W | This device uses ultrasonic vibrations and load to perform tasks such as wire harness, metal foil, and metal terminal bonding. It is a precision high-speed servo press device that emphasizes high rigidity and high load capacity through a rigid mechanism, enabling high-speed operation. This device has a judgment function based on thresholds for the parameters of load, ultrasonic oscillation, and time. It is capable of graphing the load, ultrasonic oscillation, and motor position for each processing operation. |
| USDB-AGM35kHz-900W | This device uses ultrasonic vibrations and pressure to perform tasks such as wire harness, metal foil, and metal terminal bonding. It is equipped with a 35kHz ultrasonic oscillator manufactured by RINOC. The device emphasizes high rigidity and high load capacity through a rigid mechanism and employs a precision high-speed servo press that enables high-speed operation. Each parameter, including load, ultrasonic, and time, can be controlled individually. The device can graph the processing results for each operation and transfer them to a PC. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
