[Ended] On June 22 (Friday), at the Science & Technology Company seminar "Changing Semiconductor Packaging," I will give a presentation titled "Latest Trends in Temporary Bonding and Debonding Technologies for FO-WLP."

On June 22, 2018 (Friday), I will give a presentation titled "Latest Trends in Temporary Bonding and Debonding Technology for FO-WLP" at the Science & Technology Company seminar "Changing Semiconductor Packaging."
1. Application of Temporary Bonding/Debonding Technology to FO-WLP
1.1 Background of Temporary Bonding/Debonding Technology
1.2 Applications of Temporary Bonding/Debonding Technology
1.3 Basic Processes of 2.5D/3D Stacking
1.4 Basic Processes of FO-WLP
2. XBS300 Bonding Equipment
2.1 XBS300 Platform
2.2 Support for Warped Wafer Transport
3. XBC300 Gen2 Debonding and Cleaning Equipment
3.1 XBC300 Gen2 Platform
3.2 Mechanical Debonding
3.3 Laser Debonding
3.4 Cleaning Equipment Compatible with Tape Frames
3.5 Detaper
4. Conclusion
5. Q&A Session

Date and time | Friday, Jun 22, 2018 10:30 AM ~ 05:00 PM Our presentation time is from 16:00 to 17:00. |
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Capital | Hamamatsucho, Minato-ku, Tokyo, Fukurasia Hamamatsucho (KDX Hamamatsucho Center Building 6F) Conference Room C |
Entry fee | Charge |
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