Fully automatic wafer bonder for mass production, compatible with various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components.
【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.
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basic information
The XBS200 is a fully automated platform that supports a variety of bonding processes and can handle wafers and substrates of various sizes and types ranging from 100mm to 200mm, making it a flexible tool suitable for diverse applications and process environments. It is used in a wide range of fields, including the fabrication of devices such as MEMS, LEDs, advanced packaging, and 2.5D/3D stacking, as well as wafer-level packaging. The transition from the general-purpose bonding devices SB6/8 Gen2 and XB8 can be carried out smoothly. For more details, please refer to the catalog.
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Company information
Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.