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  6. Fully Automatic Wafer Bonder XBS200

Fully Automatic Wafer Bonder XBS200

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XBS200

last updated:Jul 02, 2018

ズース・マイクロテック
ズース・マイクロテック
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Fully automatic wafer bonder for mass production, compatible with various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components.

【Features】 ■ Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. ■ Compatible with wafers and substrates ranging from 100mm to 200mm in diameter, and stacking thicknesses up to 6mm. ■ Achieves high-precision post-bond alignment accuracy through the combination of a high-precision bond aligner module XBS200 and an innovative transport mechanism. ■ Control of the bonding environment through vacuum or gas atmosphere control.

    SensorsMemory
_MG_7683_bearb_Original_6144.jpg

Fully Automatic Wafer Bonder XBS200

_MG_7683_bearb_Original_6144.jpg
_MG_7683_bearb_Original_6144.jpg
  • Related Link - https://www.suss.com/en/products-solutions/wafer-b…

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basic information

The XBS200 is a fully automated platform that supports a variety of bonding processes and can handle wafers and substrates of various sizes and types ranging from 100mm to 200mm, making it a flexible tool suitable for diverse applications and process environments. It is used in a wide range of fields, including the fabrication of devices such as MEMS, LEDs, advanced packaging, and 2.5D/3D stacking, as well as wafer-level packaging. The transition from the general-purpose bonding devices SB6/8 Gen2 and XB8 can be carried out smoothly. For more details, please refer to the catalog.

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ズース・マイクロテック

ズース・マイクロテック

Electronic Components and Semiconductors

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Zeus Microtech is one of the world's leading suppliers of microfabrication equipment, boasting over 70 years of engineering experience in the semiconductor industry and its related markets. We offer a wide range of products and solutions for lithography, wafer bonding, and photomask processing in semiconductor backend processes, as well as associated micro-optics components. Zeus Microtech continues to provide equipment that offers excellent performance/cost-effectiveness, accommodates special specifications, and flexibly adapts to diverse and rapidly changing manufacturing environments in markets such as MEMS, LEDs, advanced packaging, three-dimensional stacking, power semiconductors, and nanotechnology.

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