Leave it to us for ultrasonic plastic welding machines.
This is a production-capacity type ultrasonic plastic welding machine developed based on extensive achievements, excelling in performance in production environments. 【Features】 ○ Equipped with a high-performance oscillator that allows for a variety of parameter settings in various welding modes ○ Capable of database management for welding time, melt amount, energy, and other data ○ Achieves high reproducibility in welding finish accuracy with a highly rigid welding stand ○ Easy to integrate into automated systems ● For more details, please contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.