Leave it to us when it comes to ultrasonic oscillators.
This is a high-performance ultrasonic oscillator AGM designed for integration into automated production lines. 【Features】 ○ Easy parameter manipulation and complete database management via dedicated PC software ○ Ability to manage all tasks through parameter signals from external controllers ○ Welding modes include three types of oscillation control: time, energy, and continuous ○ Achieves reproducible plastic welding through limit functions for frequency, time, and energy ● For more details, please contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.