Standardization of horn shape and easy jig design achieve long-term life.
We will perform welding of thin film composite sheets and films using ultrasonic technology. 【Features】 ○ Ultrasonic 70kHz enables welding of ultra-thin sheets and films ○ Diversification of lower jig shapes allows for various sealing and welding surfaces ○ Simplifying the horn shape improves wear resistance ○ Low electricity consumption reduces running costs ○ Compact converter designed for space-saving ○ Easy integration into automatic machines when combined with AGM oscillators ● For more details, please contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.