We capture the minute and ultra-thin residue as an image.
In recent years, with the introduction of lead-free solder, the flux components have also been improved (with higher activity and heat resistance, etc.), leading to increased corrosiveness and a growing importance of residue issues. Therefore, the removal of flux is required. An analysis of foreign substances in the electrode parts of printed circuit boards using TOF-SIMS revealed the presence of flux components.
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Measurement method: TOF-SIMS Product field: Electronic components Analysis purpose: Composition evaluation, identification, composition distribution evaluation
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!