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  6. Contract processing of analytical chips for electrochemical measurements: Calculating dielectric constant from the desired capacitance.

Contract processing of analytical chips for electrochemical measurements: Calculating dielectric constant from the desired capacitance.

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last updated:Dec 24, 2024

安達新産業 本社
安達新産業 本社
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We offer contract processing for analytical chips for electrochemical (bio) measurements.

Are you facing any of these issues? - It's difficult to manage delivery times when ordering thin film processing and pattern processing separately. - I haven't put it into a drawing, but can you provide consultation? - I want to achieve fine wiring, but I would like advice on film materials. - Can you accept just pattern processing? - Can you handle line and space (L/S) down to 10μm? 1) We realize fine pattern processing. We achieve fine patterning through photolithography, etching, and metal masks. We select the best processing method and resist according to the customer's requirements. 2) We can provide integrated production from substrate procurement to film formation. At Adachi New Industry, we can respond to custom orders consistently from substrate procurement to film processing, fine processing, and chip processing. It is also possible to cut into any shape and ship as components. However, we need detailed drawings, etc. 3) We accommodate cleanroom requirements. The working environment maintains the necessary cleanliness for each stage from film formation to inspection, and we have a thorough system in place to address minor film defects (such as foreign substances in the film).

    Surface treatment contract service
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Contract processing of analytical chips for electrochemical measurements: Calculating dielectric constant from the desired capacitance.

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  • Related Link - https://www.e-coating.jp/solutions/pattern/lineup1…

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basic information

【1】Processing Accuracy ● Electrode Line Width: Several μm ● Electrode Spacing: Several μm (Please consult us for sub-μm and nm level patterns.) 【2】Electrode Materials ● Au, Pt, Ag, C, ITO, DLC, alloys, etc. ● Organic films, insulating films, etc. ● Selective permeable films, etc. ● Multilayer electrodes of dissimilar metals and alloys 【3】Small-scale prototyping is also possible. In manufacturing, the cycle of hypothesis and verification is an essential process. No matter how advanced simulation technology becomes, verification cannot be omitted. Therefore, at Adachi New Industry, we are happy to undertake prototyping for characteristic verification. Please contact us first. *All products are custom-made, and we accept orders with a consistent system from electrode configuration, drawing creation, to chip processing.

Price information

The price will vary depending on the pattern shape and quantity. Please feel free to contact us first. We would appreciate it if you could provide the following information at the same time to ensure a smooth proposal: - Purpose - Information about the metal film: number of layers, thickness - Substrate information: glass, resin, Si wafer, SiC wafer, etc. - Product size, thickness - Pattern drawing - Final product (as much information as you can share).

Delivery Time

P4

Applications/Examples of results

● Electrochemical analysis, organic semiconductor analysis electrodes ● Bioscience, organic electronics ● Electrodes for various sensors (gas sensors, etc.) ● Electrodes for SOFC (solid oxide fuel cell) materials ● Others, special fine electrodes, etc.

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Electrochemical analysis chip contract manufacturing Adachi New Industry Co., Ltd.

Electrochemical analysis chip contract manufacturing Adachi New Industry Co., Ltd.

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Pattern processing_photolithography_etching Adachi New Industry Co., Ltd.

Pattern processing_photolithography_etching Adachi New Industry Co., Ltd.

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Metalized Pattern Processing Adachi New Industry Co., Ltd.

Metalized Pattern Processing Adachi New Industry Co., Ltd.

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News about this product(31)

Added 'Flexible Devices and Sputtering' to the technology trend keywords.

  • Product news

In recent years, the evolution of electronic devices has garnered significant attention for flexible devices. These devices leverage their ability to be bent and stretched, with applications expected in various fields such as wearable devices, next-generation displays, and medical equipment. One of the key technologies supporting this realization is "sputtering." Sputtering excels in the precision and diversity of thin film formation, making it possible to create layers with advanced functions on flexible substrates. This document describes the role of sputtering technology in flexible devices and examples of its applications. 1. What are flexible devices 2. Main application areas 3. Key points for forming sputtered thin films suitable for flexible devices For more details, please check our company website.

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I added 'TEG chips for SiC' to the technical trend keywords.

  • Company news

In semiconductor manufacturing, TEG (Test Element Group) chips are essential for evaluating the accuracy and stability of processes. To detect subtle variations in the manufacturing line and improve yield, extremely high technology is required for the metallization (wiring formation) and patterning on TEG chips. In particular, SiC power devices are characterized by high voltage resistance, high-temperature operation, and high-frequency operation, and they exhibit different failure modes and mechanisms compared to silicon (such as breakdown under high electric fields, interface traps, and degradation originating from grain boundaries). Therefore, a TEG specifically for the SiC process is necessary. 【1】What is a TEG chip? - Purpose and Importance 【2】Key Technical Challenges in SiC Processing (Considerations during TEG Fabrication) 【3】Metallization Technology 【4】Patterning Technology 【5】Cross-Impact of SiC Device Technology and Market Summary For more details, please visit our website.

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Added 'Dielectric multilayer film deposition on thin substrates and warpage countermeasures' to the technology trend keywords.

  • Company news

In recent years, with the miniaturization and enhancement of optical devices, there has been a growing demand for the deposition of dielectric multilayers on thin glass substrates and film substrates. However, challenges arise when the film stress generated during deposition causes the substrate to warp or the film to curl. Such deformations significantly impact product performance and processing accuracy, necessitating solutions. 【1】Challenges and causes of warping and curling due to film stress 【2】Innovations in deposition fixtures to suppress warping and their benefits 【3】The importance of controlling film stress through optimization of deposition conditions and case studies 【4】Support for cutting processes on thin substrates - Scribe & Dicing Summary For more details, please visit our company website.

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We have added the 'comb-shaped electrode (copper, lithography, glass substrate electrode)' to our standard inventory.

  • Company news

We have added a standard stock lineup for the "comb-shaped electrodes (copper, lithography, glass substrate electrodes)" that has received many inquiries! If you are considering comb-shaped electrodes (copper vapor deposition electrodes), please feel free to use them. We offer a variety of line widths: 5, 10, 20, 50, 100, and 200 μm. ◆ About standard stock items from Adachi New Industry Co., Ltd.: - I need a few pieces at different levels for product development and performance testing quickly... - I want to try out a few samples for now... - I would like to make slight changes to the shape for prototyping... Adachi New Industry sincerely listens to the voices of such customers! In today's world, where simulation technology has advanced, we will respond quickly to customer requests by providing standard stock items, so please feel free to contact us!

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Company information

安達新産業

安達新産業 本社

Optical Instruments

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  • Official site
Phone number/address

Since our founding in Taisho 8 (1919), we have cultivated an extensive network as a chemical industrial trading company and will respond to all of our customers' needs through various surface treatment technologies, including optical thin film processing (optical coating). Company Name: Adachi Shinsangyo Co., Ltd. Representative Director: Kensuke Adachi Capital: 10 million yen Founded: November, Taisho 7 (1918) Established: August, Showa 39 (1964) Location: ■ Head Office: 10F Anix Building, 1-14-20 Tachiuri-bori, Nishi-ku, Osaka 550-0012 Phone: 06-6536-2051 / FAX: 06-6536-2015 ■ Higashi-Osaka Factory: 3-3-1 Tamakushicho Higashi, Higashi-Osaka City 578-0932 Phone: 072-962-4133 / FAX: 072-964-9055 Group Companies: Osaka Vacuum Industry Co., Ltd., Adachi Kousan Co., Ltd.

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