I added 'TEG chips for SiC' to the technical trend keywords.
In semiconductor manufacturing, TEG (Test Element Group) chips are essential for evaluating the accuracy and stability of processes. To detect subtle variations in the manufacturing line and improve yield, extremely high technology is required for the metallization (wiring formation) and patterning on TEG chips. In particular, SiC power devices are characterized by high voltage resistance, high-temperature operation, and high-frequency operation, and they exhibit different failure modes and mechanisms compared to silicon (such as breakdown under high electric fields, interface traps, and degradation originating from grain boundaries). Therefore, a TEG specifically for the SiC process is necessary.
【1】What is a TEG chip? - Purpose and Importance
【2】Key Technical Challenges in SiC Processing (Considerations during TEG Fabrication)
【3】Metallization Technology
【4】Patterning Technology
【5】Cross-Impact of SiC Device Technology and Market
Summary
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