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  6. Comb-shaped electrode processing (custom-made pattern chips will be created).

Comb-shaped electrode processing (custom-made pattern chips will be created).

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last updated:Aug 21, 2023

安達新産業 本社
安達新産業 本社
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This is a "comb-shaped electrode chip" made by thin-film pattern processing of various metals. We handle everything from electrode configuration to thin-film processing and chip processing in a consistent system.

Are you troubled by such issues? - It’s difficult to manage delivery times when ordering thin film processing and pattern processing separately. - I haven’t put it into a drawing, but could you provide some consultation? - I want to achieve fine wiring, but I would like advice on the deposition materials. - Can you accept orders for pattern processing alone? - Can you accommodate a line and space (L/S) of 10μm? ■ Microfabrication Technology We realize fine patterning through photolithography, etching, and metal masks. Depending on customer requirements, we select the best processing methods and resists. However, it is necessary to align conditions such as deposition materials, substrates, film thickness, and thin film stacking configurations. Please consult us regarding sub-micron or nanometer level patterns. ■ Small-scale prototyping is also possible. In manufacturing, the cycle of hypothesis and verification is an essential process. No matter how advanced simulation technology becomes, verification cannot be omitted. Therefore, at Adachi New Industry, we are happy to undertake prototyping for characteristic verification. Please contact us first.

    Circuit board design and manufacturingOther physicochemical equipmentAnalytical Equipment and Devices
img-comb-shaped1.jpg

Comb-shaped electrode processing (custom-made pattern chips will be created).

img-comb-shaped1.jpg
img-comb-shaped1.jpg
  • Related Link - https://www.e-coating.jp/solutions/pattern/lineup2…

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basic information

1) Thin Film Deposition Achievements Using vacuum deposition and sputtering processes, we can create films with a variety of metals and dielectrics. We have a wide range of substrate types with proven results. We will propose the optimal thin film configuration. ■ Metal/Alloy Single Layer Films Au, Ag, Pt, Cu, Ti, Cr, Ni, Al, DLC, ITO, and other metals and alloys ■ Dielectric Films Various metal oxides, nitrides, insulating films, etc. ■ Compatible Substrates Various glasses, resins, films, and various wafers (Si, SiC, Ge, GaN, etc.) ■ Work Size We can accommodate sizes up to 150mm. 2) Fine Pattern Processing Accuracy Electrode line width: a few μm, electrode spacing: a few μm, film thickness: from several tens of nm to a few μm 3) Integrated Production from Substrate Procurement to Film Deposition At Adachi New Industry, we can provide a fully customized service from substrate procurement to film processing, fine processing, and chip processing. It is also possible to cut to any shape and ship as components. 4) Clean Room Compliance The working environment maintains the necessary cleanliness levels from film deposition to inspection, and we have a robust system in place to address minor film defects (such as foreign particles in the film).

Price information

It will vary depending on the quantity, size, and pattern accuracy. Please feel free to contact us first. We would appreciate it if you could provide the following information simultaneously to facilitate a smooth proposal: - Purpose - Information about the metal film: number of layers, thickness - Substrate information: glass, resin, Si wafer, SiC wafer, etc. - Product size, thickness - Pattern drawings - Final product (as much information as you can share).

Delivery Time

Please contact us for details

Applications/Examples of results

- Electrochemical analysis chip - Bioscience, organic electronics - TEG chip - Organic semiconductor analysis electrode - Electrodes for various sensors (e.g., gas sensors) - Electrode for SOFC (solid electrolyte) materials, etc.

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Pattern processing_photolithography_etching Adachi New Industry Co., Ltd.

Pattern processing_photolithography_etching Adachi New Industry Co., Ltd.

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Metalized Pattern Processing Adachi New Industry Co., Ltd.

Metalized Pattern Processing Adachi New Industry Co., Ltd.

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Electrochemical analysis chip contract manufacturing Adachi New Industry Co., Ltd.

Electrochemical analysis chip contract manufacturing Adachi New Industry Co., Ltd.

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News about this product(33)

We will be exhibiting at the "Decoration Technology Exhibition 2026."

  • Company news

We would like to inform you that we will be exhibiting at the "Decoration Technology Exhibition 2026: 'Textures that Captivate the Eyes and Heart'" to be held on January 23, 2026 (Friday) at the Osaka Industrial Creation Center (Organizer: Osaka Industrial Promotion Organization). 【About the Exhibition】 Date and Time: January 23, 2026 (Friday) 10:30 AM - 4:30 PM Location: Osaka Industrial Creation Center, 3rd Floor, Booth No. 1-4-5 Honmachi, Chuo Ward, Osaka City, 541-0053 Exhibition Content: We will introduce innovations in surface treatment! Our group will undertake a series of contract processing treatments, from vacuum deposition and sputtering to UV hard coating. ◆ Vacuum deposition and sputtering products ◆ UV hard coating products ◆ Optical thin film (metal mirror) products, pattern processing products *Advance registration is required, so please apply here. *Please note that the reception is on the 4th floor.

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Added 'Flexible Devices and Sputtering' to the technology trend keywords.

  • Product news

In recent years, the evolution of electronic devices has garnered significant attention for flexible devices. These devices leverage their ability to be bent and stretched, with applications expected in various fields such as wearable devices, next-generation displays, and medical equipment. One of the key technologies supporting this realization is "sputtering." Sputtering excels in the precision and diversity of thin film formation, making it possible to create layers with advanced functions on flexible substrates. This document describes the role of sputtering technology in flexible devices and examples of its applications. 1. What are flexible devices 2. Main application areas 3. Key points for forming sputtered thin films suitable for flexible devices For more details, please check our company website.

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I added 'TEG chips for SiC' to the technical trend keywords.

  • Company news

In semiconductor manufacturing, TEG (Test Element Group) chips are essential for evaluating the accuracy and stability of processes. To detect subtle variations in the manufacturing line and improve yield, extremely high technology is required for the metallization (wiring formation) and patterning on TEG chips. In particular, SiC power devices are characterized by high voltage resistance, high-temperature operation, and high-frequency operation, and they exhibit different failure modes and mechanisms compared to silicon (such as breakdown under high electric fields, interface traps, and degradation originating from grain boundaries). Therefore, a TEG specifically for the SiC process is necessary. 【1】What is a TEG chip? - Purpose and Importance 【2】Key Technical Challenges in SiC Processing (Considerations during TEG Fabrication) 【3】Metallization Technology 【4】Patterning Technology 【5】Cross-Impact of SiC Device Technology and Market Summary For more details, please visit our website.

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We have added the 'comb-shaped electrode (copper, lithography, glass substrate electrode)' to our standard inventory.

  • Company news

We have added a standard stock lineup for the "comb-shaped electrodes (copper, lithography, glass substrate electrodes)" that has received many inquiries! If you are considering comb-shaped electrodes (copper vapor deposition electrodes), please feel free to use them. We offer a variety of line widths: 5, 10, 20, 50, 100, and 200 μm. ◆ About standard stock items from Adachi New Industry Co., Ltd.: - I need a few pieces at different levels for product development and performance testing quickly... - I want to try out a few samples for now... - I would like to make slight changes to the shape for prototyping... Adachi New Industry sincerely listens to the voices of such customers! In today's world, where simulation technology has advanced, we will respond quickly to customer requests by providing standard stock items, so please feel free to contact us!

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Company information

安達新産業

安達新産業 本社

Optical Instruments

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Since our founding in Taisho 8 (1919), we have cultivated an extensive network as a chemical industrial trading company and will respond to all of our customers' needs through various surface treatment technologies, including optical thin film processing (optical coating). Company Name: Adachi Shinsangyo Co., Ltd. Representative Director: Kensuke Adachi Capital: 10 million yen Founded: November, Taisho 7 (1918) Established: August, Showa 39 (1964) Location: ■ Head Office: 10F Anix Building, 1-14-20 Tachiuri-bori, Nishi-ku, Osaka 550-0012 Phone: 06-6536-2051 / FAX: 06-6536-2015 ■ Higashi-Osaka Factory: 3-3-1 Tamakushicho Higashi, Higashi-Osaka City 578-0932 Phone: 072-962-4133 / FAX: 072-964-9055 Group Companies: Osaka Vacuum Industry Co., Ltd., Adachi Kousan Co., Ltd.

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