We have added 'Co-creation Proposal! Migration Chip for Chemical Manufacturers' to the technology trend keywords.
In the development of coating materials for semiconductors and functional chemicals, the evaluation of resistance to electromigration and ion migration has become an unavoidable and important theme. On the other hand, migration is not a phenomenon that can be simply determined by material properties alone. The differences in insulating films, protective films, and coating materials interact with wiring materials and current conditions in ways such as hygroscopicity, ion residue, barrier properties, dielectric characteristics, film thickness, film density, and interfacial adhesion, ultimately manifesting as wiring degradation or insulation breakdown. However, in actual evaluation settings:
◆ The wiring structure and material conditions differ with each evaluation.
◆ The effects of materials and structural factors cannot be separated.
◆ Reproducibility and comparability of evaluation results are difficult to achieve.
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