Information on standard stock items (optical filters)

At Adachi New Industry Co., Ltd., we prepare standard stock items that are easy to verify in order to facilitate smoother product development for our customers. Gold mirrors (Au mirrors) are optical elements that use the precious metal "gold (Au)" as a reflective film material, exhibiting an extremely high reflectivity (>96%) in the infrared spectral range (800 nm to 2 µm). Please make use of them. ◆◆ Are you facing any of these issues? - The performance varies significantly depending on the reflective wavelength range of the gold mirror, requiring technical judgment to select the most suitable specifications for the application. - There are differences in quality parameters such as film thickness accuracy, uniformity, adhesion strength, and surface roughness, making selection difficult. - Optical components using high-purity gold have complex manufacturing processes and are easily affected by material procurement. - Price differences can be significant due to fluctuations in gold costs and the precision of manufacturing equipment, making simple price comparisons challenging. - The wavelength range and incident angle characteristics may not match requirements, leading to risks and costs associated with reordering. - It is difficult to find processing sources that can produce stable prototypes in small quantities. Please check our website for more information.

In recent years, the evolution of electronic devices has garnered significant attention for flexible devices. These devices leverage their ability to be bent and stretched, with applications expected in various fields such as wearable devices, next-generation displays, and medical equipment. One of the key technologies supporting this realization is "sputtering." Sputtering excels in the precision and diversity of thin film formation, making it possible to create layers with advanced functions on flexible substrates. This document describes the role of sputtering technology in flexible devices and examples of its applications. 1. What are flexible devices 2. Main application areas 3. Key points for forming sputtered thin films suitable for flexible devices For more details, please check our company website.

In semiconductor manufacturing, TEG (Test Element Group) chips are essential for evaluating the accuracy and stability of processes. To detect subtle variations in the manufacturing line and improve yield, extremely high technology is required for the metallization (wiring formation) and patterning on TEG chips. In particular, SiC power devices are characterized by high voltage resistance, high-temperature operation, and high-frequency operation, and they exhibit different failure modes and mechanisms compared to silicon (such as breakdown under high electric fields, interface traps, and degradation originating from grain boundaries). Therefore, a TEG specifically for the SiC process is necessary. 【1】What is a TEG chip? - Purpose and Importance 【2】Key Technical Challenges in SiC Processing (Considerations during TEG Fabrication) 【3】Metallization Technology 【4】Patterning Technology 【5】Cross-Impact of SiC Device Technology and Market Summary For more details, please visit our website.

In recent years, with the miniaturization and enhancement of optical devices, there has been a growing demand for the deposition of dielectric multilayers on thin glass substrates and film substrates. However, challenges arise when the film stress generated during deposition causes the substrate to warp or the film to curl. Such deformations significantly impact product performance and processing accuracy, necessitating solutions. 【1】Challenges and causes of warping and curling due to film stress 【2】Innovations in deposition fixtures to suppress warping and their benefits 【3】The importance of controlling film stress through optimization of deposition conditions and case studies 【4】Support for cutting processes on thin substrates - Scribe & Dicing Summary For more details, please visit our company website.