We can accommodate from BGA packages to 12” wafers!
□ The BGA package is compact yet designed with 6 zones. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for in-furnace purification. □ Wafer transport uses a uniquely developed walking beam method.
Inquire About This Product
basic information
We have a product lineup that supports everything from BGA packages to 12” wafers. We are always equipped with testing machines and can respond to our customers' needs at any time. Please feel free to consult with us!
Price range
Delivery Time
Applications/Examples of results
(Main Uses and Examples of Achievements) □ BGA package substrates □ Wafer-level CSP bump formation □ QFP and other electronic component mounting, etc.
catalog（3）
Download All Catalogs
Company information
Dainichi Shoji Co., Ltd. was established in 1959 as an import trading company and has since provided products such as temperature sensors, plastic products, consumables, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, creating a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to quickly respond to customer requests and problem-solving, along with our commitment to manufacturing. To survive in the rapidly changing electronics industry, we continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.