Establishment of failure determination criteria and reliability evaluation backed by statistical evidence!
Instructor Masahiro Satake, Representative of the Soldering Technology Center Target Audience: Researchers and engineers from companies (design, quality assurance, production technology, manufacturing technology, etc.), site supervisors Venue: Moriguchi City International Exchange Center, Room 2 [Osaka, Moriguchi City] 5-minute walk from Keihan Electric Railway "Moriguchi City" Station, 4-minute walk from Tanimachi Subway Line "Moriguchi" Station, Exit 4 immediately to the right Date and Time: July 21, 2011 (Thursday) 10:30 AM - 4:30 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: 49,350 yen (tax included, lunch included, text cost included) for up to 2 people from one company *Members who register by July 7 will receive an early bird discount price of 46,200 yen ◆69,300 yen for applications from 3 people from the same corporation ◆About the subsidy system for seminar participation fees
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basic information
We have been providing extensive development support for lead-free solder joints, and recently, we have been moving towards a higher level of completeness, including the establishment of failure judgment criteria and statistically validated reliability evaluation methods. Additionally, sufficient verification has been obtained for design techniques to avoid implementation defects. Therefore, in this presentation, we have made an effort to clearly explain the points of design techniques and quality improvement using videos.
Price range
P2
Delivery Time
P2
Applications/Examples of results
1. Basics of Soldering 1-1. Characteristics of Soldering 1-2. Formation of Alloy Layer (Intermetallic Compound) 1-3. Wetting of Solder 2. Basics of Flux 3. Reliability Evaluation 4. Initial Analysis Cases through Visual Observation 5. Future Design Technologies 5-1. What High Temperature Means for Solder 5-2. Substrate and Coefficient of Thermal Expansion 5-3. Expansion and Contraction of Substrate during Soldering 5-4. Substrate and Copper Foil Thickness 5-5. Design Standards Required for Through-Hole Up 5-6. Design Standards Required for Zero Bridge Defects 5-7. Others (Shadow Placement) 5-8. Component Misalignment 5-9. Fillet and Lifespan 5-10. What is a “Good” Temperature Profile? 5-11. Temperature Profile from the Component Side 5-12. Temperature Profile from the Material Side 5-13. Key Points for Setting Reflow Temperature Profile 5-14. Key Points for Setting Flow Temperature Profile
Company information
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