Due to the low variation in plating thickness and high reproducibility of the plating, inspections can be significantly reduced.
The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.
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basic information
【Features】 ○ Fully automatic plating from magazine to magazine ○ Minimal variation in plating thickness (+/-10%) ○ High reproducibility of plating allows for significant reduction in inspection ○ Deburring process with high-pressure water (optional) ○ Maintains a good working environment ○ Easy process and product count management through SPC control (minimizing human factors) ● For more details, please contact us.
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Company information
Our company was established in April 1992 as a joint venture with Technique and Kanematsu Corporation, focusing on solder exterior plating equipment and chemicals. Subsequently, in February 1999, Technique acquired all shares, and it has since become a 100% subsidiary. Technique manufactures various precious metal plating chemicals, non-ferrous metal plating chemicals such as copper, nickel, tin, solder, and their pretreatment chemicals, as well as various automatic plating equipment, RTA analyzers, and precious metal powders. We intend to gradually introduce Technique's diverse products to the Japanese market, and we kindly ask for your support.
