Pattern plating system that achieves uniform thickness even in high aspect ratio holes.
The PTN pattern plating system ensures uniform plating thickness in deep holes through a precise panel positioning mechanism and optimized agitation control. It is ideal for high precision pattern plating processes, providing stable quality and excellent reproducibility. The system maintains accurate alignment between the panel and anode even during agitation, ensuring consistent plating results. It also supports large scale production, achieving a throughput of 50–100 panels per hour. With in house manufacturing of plating chemicals, we offer total support for both equipment and chemistry.
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basic information
【Features】 •Includes MPS software for random process control •Vibration, mechanical, and air agitation eliminate air trapping •Shield plates improve thickness distribution •External solution tank enables offline sampling and chemical addition •Optional cover reduces ventilation and air conditioning costs ● For more details, please contact us.
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Company information
Our company was established in April 1992 as a joint venture with Technique and Kanematsu Corporation, focusing on solder exterior plating equipment and chemicals. Subsequently, in February 1999, Technique acquired all shares, and it has since become a 100% subsidiary. Technique manufactures various precious metal plating chemicals, non-ferrous metal plating chemicals such as copper, nickel, tin, solder, and their pretreatment chemicals, as well as various automatic plating equipment, RTA analyzers, and precious metal powders. We intend to gradually introduce Technique's diverse products to the Japanese market, and we kindly ask for your support.
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