Technich Japan Product Lineup

The "Real-Time Analyzer (RTA)" is a new electrochemical analysis device focused on alternating current voltammetry. This product allows for real-time analysis of all components in electroplating copper solutions, including copper, sulfuric acid, chlorine, suppressors, accelerators, etc., simply by immersing a probe with three electrodes in a storage tank, contributing to the stability of plating quality. Additionally, there is no need to dilute the plating solution or add reagents, enabling automatic analysis with an extremely simple system. 【Features】 ■ Real-time analysis ■ Contributes to quality stability ■ Automatic analysis possible with a simple system *For more details, please refer to the catalog or feel free to contact us.

• Plating Equipment
• Analytical Equipment and Devices

The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.

• Other surface treatment equipment
• Plating Equipment

The PTN pattern plating system ensures uniform plating thickness in deep holes through a precise panel positioning mechanism and optimized agitation control. It is ideal for high precision pattern plating processes, providing stable quality and excellent reproducibility. The system maintains accurate alignment between the panel and anode even during agitation, ensuring consistent plating results. It also supports large scale production, achieving a throughput of 50–100 panels per hour. With in house manufacturing of plating chemicals, we offer total support for both equipment and chemistry.

• Other surface treatment equipment
• Plating Equipment

The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.

• Other surface treatment equipment
• Plating Equipment

It is possible to transport delicate strip materials or films, such as 50-micron thick polyimide film, by clipping them from above and below. When combined with a shield, stable plating can be achieved. Since power is supplied from the clips, there is no need for a power roll, which prevents damage to the product's surface. Additionally, the stainless steel belt that holds the clips guides the product, allowing for extremely low tension to be set on the product.

• Other surface treatment equipment
• Plating Equipment

The SBE jet flow plating system individually agitates micro sized workpieces (0.1–5 mm) with a high speed jet stream, enabling stable and uniform thin film deposition. It delivers consistent plating quality that is difficult to achieve with conventional barrel or vibratory plating systems, improving both product quality and yield for micro components. By rotating the jet stream at approximately 700 cycles per hour, the system achieves high throughput, excellent uniformity, and reduced plating cost. It is ideal for plating processes involving electronic components and precision micro parts.

• Other surface treatment equipment
• Plating Equipment