The advanced pattern plating equipment of the technique sets the industry standard.
The plating device "Pattern Plating Device" achieves a uniform plating layer even in high aspect ratio holes. The panel positioning system ensures that the positions of the panel and anode are kept horizontal during stirring. Our large-scale plating systems have a throughput of over 50-100 panels per hour. We manufacture chemicals for all processes involved in substrate plating and cater to all needs from equipment to chemicals. For more details, please contact us.
Inquire About This Product
basic information
【Features】 ○ Comes with MPS software for random process techniques ○ Eliminates air traps caused by vibration, mechanical agitation, or air stirring ○ Improves plating thickness distribution with shielding plates ○ Allows offline sampling and chemical addition with an external storage tank ○ Contributes to reducing ventilation and air conditioning costs by installing an optional cover ● For more details, please contact us.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us.
Company information
Our company was established in April 1992 as a joint venture with Technique and Kanematsu Corporation, focusing on solder exterior plating equipment and chemicals. Subsequently, in February 1999, Technique acquired all shares, and it has since become a 100% subsidiary. Technique manufactures various precious metal plating chemicals, non-ferrous metal plating chemicals such as copper, nickel, tin, solder, and their pretreatment chemicals, as well as various automatic plating equipment, RTA analyzers, and precious metal powders. We intend to gradually introduce Technique's diverse products to the Japanese market, and we kindly ask for your support.