Numerous installation achievements. It is possible to reduce the amount of gold used by equalizing the plating thickness.
The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.
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basic information
【Features】 ○ Reduction of gold usage due to uniform plating thickness ○ High adaptability to process changes due to modular design ○ Maintenance-free, low-friction transport system with automatic guide mechanism accommodating differences in panel thickness ○ Easy maintenance with a quick disconnect mechanism for removable plating tanks and sprayer piping ○ Low-pressure, high-capacity sprayer design significantly reduces the burden of water and wastewater treatment ● For more details, please contact us.
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Company information
Our company was established in April 1992 as a joint venture with Technique and Kanematsu Corporation, focusing on solder exterior plating equipment and chemicals. Subsequently, in February 1999, Technique acquired all shares, and it has since become a 100% subsidiary. Technique manufactures various precious metal plating chemicals, non-ferrous metal plating chemicals such as copper, nickel, tin, solder, and their pretreatment chemicals, as well as various automatic plating equipment, RTA analyzers, and precious metal powders. We intend to gradually introduce Technique's diverse products to the Japanese market, and we kindly ask for your support.
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