Cutting the substrate with the blade rotating at a high speed of up to 200mm/sec! No need for water or fixing UV tape, reducing costs.
The dry-type dicer SAM-CT1520D achieves sharp cutting surfaces without applying stress by rotating the blade at high speed to cut the substrate. (Cutting speed: 20mm/sec to 200mm/sec, cutting width: 0.1mm to 0.5mm) Thanks to a powerful dust collection system, the adhesion of chips to the substrate is minimal. Since no water is used, water supply and drainage facilities are not required, making it environmentally friendly and reducing running costs. *Test cutting is also available.* 【Features】 ■ High-speed and high-precision cutting ■ Environmental measures and reduction of running costs ■ Safe cutting and workpiece decharging ■ High operability *For more details, please refer to the materials by clicking the "PDF Download" button.* *If you wish to conduct a demonstration with a demo machine, please check "Request for Demo" when contacting us via "Web Inquiry."*
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basic information
【Other Features】 - By rotating the blade at high speed to cut the substrate, a sharp cutting edge is achieved without applying stress. - A powerful dust collection system ensures minimal debris attachment to the substrate. - No water is required, eliminating the need for water supply and drainage facilities, making it environmentally friendly and reducing running costs. - The substrate is fixed using a substrate holder jig and vacuum suction, eliminating the need for UV tape, etc. - The blade can be selected according to the substrate for optimal performance. → GC grinding stone, diamond disc, metal saw - Four-axis control enables high-precision cutting. - Equipped with image recognition (CCD camera) as standard, allowing for high-precision cutting. - Standard features include detection of blade damage and wear. Safe cutting is possible with static elimination blow. - Various operations can be performed via PC, and guidance is displayed on the monitor in case of errors. ● For more details, please download the catalog or contact us.
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Company information
Sayaka is not only unique in its products but also in its management. Since its founding in 1975, it has transformed its business model from 1. broker 2. technology trading company 3. contract manufacturing company 4. development-oriented company. These changes have been created through management planning meetings involving all employees. By making all employees active participants, we aim to voluntarily pursue our roles and create technologies and products that are competitive on a global scale. ● We want to commercialize our own know-how ● We want to automate our own products ● We want to achieve automation and efficiency in production ● We want to solve technical bottlenecks in production ● We want to outsource production We will provide solid support for these goals!
