Manual spin coater and manual spin developer that meet a wide range of needs from research and development to production.
The Riso Spin Cup Series adopts a spin unit equivalent to automatic coating/developing equipment while being manual, and it comes standard with features such as auto dispensers, various rinses, automatic waste liquid recovery, and cup exhaust. It allows for easy and safe high-precision resist processing. Additionally, we offer various options such as primary dispensers, chemical temperature control, fan filter units, and temperature/humidity controllers, enabling advanced coating and developing processes. At Risotech Japan, we design and manufacture equipment tailored to the coating chemicals (resist, polyimide, insulating films, etc.) and wafer sizes and applications used by our customers, providing sophisticated equipment.
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basic information
<Spin Coater> ■Litho Spin Cup 800C ・Compatible with wafers from 0.5 inches to 8 inches ・Equipped with standard auto dispenser, edge rinse/back rinse ■Litho Spin Cup 1200C ・Compatible with wafers up to 300mm ・Specifications compatible with chemically amplified resist <Spin Developer> ■Litho Spin Cup 800D ・Compatible with wafers up to 8 inches ・Equipped with standard auto dispenser, developing rinse/back rinse ■Litho Spin Cup 1200D ・Compatible with wafers up to 300mm ・Also compatible with organic developing specifications
Price information
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Price range
P7
Delivery Time
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Applications/Examples of results
It is widely used for resist coating and development in the semiconductor photolithography process.
Line up（4）
| Model number | overview |
|---|---|
| Litho Spin Cup 800C | Spin coating device compatible with 8-inch wafers |
| Litho Spin Cup 1200C | Spin coating device compatible with 300 mm wafers |
| Litho Spin Cup 800D | Spin developing device compatible with 8-inch wafers |
| Litho Spin Cup 1200D | Spin developing device compatible with 300 mm wafers |
Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
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