Coating and Developing Equipment ACS300 Gen2

On December 4, 2012 (Tuesday), we will hold the SUSS Japan Seminar in 2012 at the Hyatt Regency Tokyo (Shinjuku). This year, we will conduct two seminars in parallel: the Photomask Section "Mask Integrity Challenges – Path to NGL Production" and the 3D Section "Current Status and Trends in 3D Integration Technology." We sincerely invite you to participate. 【Date】December 4, 2012 (Tuesday) 【Location】Hyatt Regency Tokyo, 27F 【General Participation Fee】¥5,000 【Details and Registration Method】http://www.suss.com/jp.html ■ Photomask Section "Mask Integrity Challenges – Path to NGL Production" 【Time】10:00 - 17:10 【Capacity】100 people ■ 3D Section "Current Status and Trends in 3D Integration Technology" 【Time】10:30 - 17:10 【Capacity】100 people ■ Joint Reception 17:15 - 19:00

On June 3rd (Friday), at Tokyo Big Sight, we will introduce the wafer process technology for 3D stacking from Zeus Microtech at the JIEP Advanced Implementation Technology Symposium/Session 3A1 "New Implementation Technologies for Next-Generation 3D Packages" (9:30–12:30). Development of 3D stacked devices using TSV is progressing in fields such as CMOS image sensors and MEMS. We will present on the lithography, thin wafer handling (temporary bonding/debonding), and wafer bonding technologies necessary for 3D stacking/integration. In this seminar, experts from various fields will also give presentations on the latest technologies in 3D implementation and next-generation packaging. □ For more details, please contact us.