Automatic resist coating and developing equipment for corner substrates (coater-developer)
Supports low to high viscosity resist! Equipment can be manufactured for any wafer size!
The product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices! We have a proven track record with a variety of chemicals including positive-negative resist, polyimide, SOG, wax, and silicone. We also have extensive experience in transporting various substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and ceramic, as well as SiO2 (glass). We have numerous achievements in transporting thin substrates and square substrates, such as GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)! 【Features】 ■ Achieves low prices ■ Capable of handling low to high viscosity (1.7cP to 10000cP) ■ Uniform film distribution through a rotating cup coating method ■ Compatible with 2 to 12 inches ■ Capable of processing multiple types of wafers (compatible with 3, 4, and 5 inches) ■ Automatic recognition of wafer size ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 1 set ■Spin Development Unit: 1 set ■Wafer Size: Φ2" to Φ12 (supports square substrates) ■Resist Dropping Nozzle: 1 set ■Development Nozzle: 1 set ■Rinse Nozzle: 1 set ■Bake Unit: 3 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
