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  5. Resist Device
  6. Maintain a constant reverse taper angle! PEB-compatible resist development equipment (developer)

Maintain a constant reverse taper angle! PEB-compatible resist development equipment (developer)

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last updated:Apr 04, 2023

エイ・エス・エイ・ピイ
エイ・エス・エイ・ピイ
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Keep the negative taper angle constant! This is an automatic resist development system compatible with post-exposure bake (PEB) required for negative resist and image reversal resist.

Equipped with sheet-type development, full exposure (inverted exposure, image reversal), baking, and cooling functions. An important PEB that determines the angle of the reverse taper using lift-off resist. Our proprietary program stabilizes the reverse taper angle! Additionally, using it for baking after exposing negative resist achieves a stable process. With a lineup tailored to production volume, from manual machines to fully automatic machines, we have realized low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals such as TMAH, colin aqueous solution, and Na2CO3. We also have numerous achievements with thin wafers (such as wafer thickness of 150um), so please feel free to consult us. 【Features】 ■ Stability of reverse taper angle through PEB ■ Automatic wafer size recognition function ■ Compatible with paddle, single-fluid spray, and dual-fluid spray ■ Reduced footprint ■ Lineup tailored to production volume We also have demo equipment available, so please consider scheduling a demonstration!

    Resist Device
コーターデベロッパー.jpg

Maintain a constant reverse taper angle! PEB-compatible resist development equipment (developer)

コーターデベロッパー.jpg
コーターデベロッパー.jpg
  • Related Link - http://www.asap-semi.co.jp/coaters/

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**Main Specifications** - Cassette Stage: 2 sets - Spin Development Unit: 2 sets - Wafer Size: Φ2" to Φ12" - Development Nozzle: 1 set/CUP - Rinse Nozzle: 1 set/CUP - Bake Unit: 2 sets (Max 200℃) - Cooling Unit: 1 set - Centering Unit: 1 set - Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) - Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.*

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※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.

Applications/Examples of results

We have a proven track record in fields such as LED, LD, SAW filters, and power devices.

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エイ・エス・エイ・ピイ

エイ・エス・エイ・ピイ

Electronic Components and Semiconductors

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We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.

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