From high pressure to mist-like soft pressure, it's all under control! A two-fluid spray resist development device. It is effective in shortening the development time for thick films and more.
This is a developing device that uses a two-fluid spray method to mix and discharge N2 and developer solution. By changing the pressure of N2, the discharge pressure of the spray can be adjusted. You can choose from a wide range of spray discharge patterns, such as increasing the liquid pressure for high-pressure discharge or reducing the liquid volume to create a fine mist for a softer discharge. The spray nozzle can be freely selected in various shapes such as fan-shaped or circular, as well as the distribution, spread angle, and range. We offer a lineup that matches production volume, from manual to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Equipped with a two-fluid spray! (Paddle can also be used) ■ Automatic wafer size recognition function ■ Proven track record with various chemicals ■ Compact design ■ Lineup tailored to production volume We have a permanent demo setup, so please consider scheduling a demonstration!
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Development Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Development Nozzle: 1 set/CUP ■ Rinse Nozzle: 1 set/CUP ■ Bake Unit: 4 sets (Max 200℃) ■ Cooling Unit: 2 sets ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1400×1100×1800 (Φ4" main body) 400×900×1800 (Chemical Supply + Power BOX) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *Please feel free to contact us for more details.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
We have a track record of sales in the fields of power devices, SAW filters, LEDs, LDs, and communications.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
