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  4. Semiconductor Manufacturing Equipment
  5. Resist Device
  6. Compact! Manual photoresist developing device (manual developer)

Compact! Manual photoresist developing device (manual developer)

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last updated:Apr 04, 2023

エイ・エス・エイ・ピイ
エイ・エス・エイ・ピイ
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It is a compact resist development system for small-lot, multi-variety production and development applications. Unlike DIP, it can stabilize quality due to its sheet-fed design.

This product is a manual sheet-type developing machine. It features a compact design that combines the chemical solution box and processing cup into one unit. We design, manufacture, and sell manual machines tailored to our customers' needs. It is used not only for research and development purposes but also by customers handling small quantities of diverse products. We have a proven track record with various chemicals, including TMAH. 【Features】 ■ Achieves low cost ■ Compact! ■ Options for paddle, single fluid spray, and dual fluid spray ■ Proven performance with a variety of chemicals *For more details, please refer to the PDF document or feel free to contact us.

    Resist Device
deve_manual.jpg

Compact! Manual photoresist developing device (manual developer)

deve_manual.jpg
deve_manual.jpg
  • Related Link - http://www.asap-semi.co.jp/coaters/

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basic information

【Main Specifications】 ■ Spin Development Unit: 1 set ■ Wafer Size: Φ2" to Φ12" ■ Development Nozzle: 1 set/CUP~ ■ Rinse Nozzle: 1 set/CUP ■ Equipment Size: (Example) 1200×800×1800 (Φ4" main body with integrated chemical supply) Many other options available!

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Delivery Time

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※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.

Applications/Examples of results

We have received inquiries for research and development purposes, small-scale production, and have sales achievements in the fields of power devices and communications.

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エイ・エス・エイ・ピイ

エイ・エス・エイ・ピイ

Electronic Components and Semiconductors

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We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.

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