Optimal for specifying inspection positions and testing measurements with set parameters. Easy to operate.
The "Wire Bonding Inspection Device" for model teaching displays images of ideal samples that have been captured, allowing for the specification of inspection positions and test measurements to be conducted with simple mouse operations using the set parameters. Results such as wire trajectories are visually displayed, making verification easy. For more details, please download the catalog.
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basic information
【Features】 ○ Wire Inspection → Tracks each wire individually to inspect for abnormalities in wire shape. ○ Au Wire Bond Ball Diameter Inspection → Inspects bond shape (aspect ratio) and can accurately check for overflow from the pad. ○ IC Scratch and Foreign Object Inspection (Optional) → Compares with inspection images to check the area and shape of any discrepancies. ○ 3D Stereo Imaging → Captures images of the workpiece using two or four cameras set at a fixed angle. ○ Wire Height Inspection → Tracks the wire using images obtained from 3D stereo imaging and compares data between opposing cameras. ● For more details, please contact us or download the catalog.
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Applications/Examples of results
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Company information
Since our company's establishment in 1986, we have long been engaged in semiconductor-related businesses that support Japan's cutting-edge technology. On the hardware side, we have developed construction and manufacturing environments, including clean rooms. On the human resources side, we have focused on training semiconductor engineers and establishing a service system that can promptly respond to customer needs. Last year, we participated in SEMICON Japan for the first time, and by directly interacting with many industry stakeholders, we were able to learn again what is currently needed and what services should be created. At the same time, the morale within the company has been rising, and we are actively conducting sales activities. It is said that the Japanese economy is finally showing signs of recovery. However, even just looking at the semiconductor industry, the entry of overseas manufacturers and the significant improvement in technology and services are remarkable, so we aim to enhance our international competitiveness in our sales expansion. Not only domestically but also in response to the era of globalization, our role as a hub connecting North America and Asia, especially given our excellent airport access, will further increase.