アローズエンジニアリング Product Lineup

Our company offers a "Dual-Sided Pattern Displacement Inspection Machine" designed for measuring pattern displacement and line width on both sides of a workpiece, as well as for microscopic observation. The auto-focus function automatically adjusts the focus at the same coordinates on both sides, and matching is performed after pattern detection. It automatically measures the center displacement of patterns and fine line widths on both sides with high precision. With the double-port option, it is possible to add infrared inspection capabilities to the visual inspection function by equipping an infrared camera for composite workpieces. 【Features】 ■ High-precision measurement performance (displacement measurement resolution of 0.1μm for both sides) ■ Infrared inspection available with the double-port option ■ Equipped with a self-designed electric revolver ■ Equipped with a self-designed XYθ flat stage unit ■ Automatic measurement possible through recipe management ■ Customization available according to your requirements *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

The "Floating Inspection Measurement Device" is a product that performs floating inspection of the soldered parts of wires with high speed and precision. By measuring the crushed height, it conducts electrical non-conductivity inspections. Using a high-precision ultra-high-speed sensor based on the principle of chromatic aberration confocal, it can measure at a speed of 36,000 lines per second, with 1,200 measurement points per line. The measurement accuracy is ±2μm. Since the incident light and detection light of the sensor follow the same path, shadowing can be ignored, allowing for accurate measurements even on complex shapes and mirror surfaces. Furthermore, it can also inspect and measure other features such as step differences, foreign objects, scratches, protrusions, and film thickness over large areas in a short time. It can easily accommodate everything from tabletop machines to fully automated 24-hour inline systems. 【Features】 ■ High-speed and high-precision floating inspection of the soldered parts of wires ■ Inspection of electrical non-conductivity through crushed height measurement ■ Accurate measurement of mirror surfaces and complex shaped workpieces ■ Compatible with everything from tabletop machines to fully automated 24-hour inline systems *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "Back Surface Crack Inspection Device" is an automatic inspection device for ceramic substrates that can be easily constructed for 24-hour inline automation. It detects fine cracks that are difficult to see with the naked eye using image processing with special lighting from two directions. The non-contact inspection measurement prevents damage to the workpiece, and the fast measurement speed is an advantage. Results are automatically saved as data, and automatic judgment of good and defective products is performed, with support for alert output in case of defects. Products inspected can be guaranteed for quality. The device can be constructed with any desired takt time and inspection accuracy. 【Features】 ■ Detection of fine cracks using special lighting from two directions and image processing ■ Non-contact inspection measurement that does not damage the workpiece ■ Automatic data saving and automatic judgment of results (good/defective) ■ Automatic alert output in case of defects ■ Construction possible with any desired takt time and inspection accuracy *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "MPI-300A" is a main roller groove inspection machine that can capture, record, and measure the entire length of groove shapes through profile cross-section imaging and electric scanning. The transmitted light from the profile camera creates a shadow cross-section of the roller, which is captured by a telecentric lens camera as it moves along the entire length of the roller, allowing for frame recording and image measurement. It is designed to be set next to the slicer on a cart for easy adjustment and inspection. 【Features】 - Capable of capturing, recording, and measuring the entire length through profile cross-section imaging and electric scanning - Supports inspection of slicer-mounted rollers and wire mode - Easily adjustable when set next to the slicer on a cart - Can be used as data for wear inspection, durability monitoring, and determining roller replacement timing *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "WEIM-12F" is a fully automatic profiler inspection machine compatible with FUPE, capable of high-precision and high-speed automatic measurements. It retrieves wafers using a robot with a double-hand inversion mechanism, aligns them, and then measures wafer thickness, diameter, notch, and profiler measurements before storing them. It is a system that allows inline management via MELCEC-net communication. 【Features】 ■ High-precision, high-speed automatic measurements ■ Two laser displacement meters measure the thickness at the center and outer edge of the wafer ■ Two width and diameter measurement devices measure the outer diameter of the wafer using the diameter method ■ Two optical cameras measure the notch and notch displacement of glass/Si from both sides *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The device is an automatic measurement system that enables quality assurance after inspection. It allows for non-contact measurement, preventing damage to the cutting edge, and eliminates issues such as contact pressure, measurement angle, and parallax, which depend on the skill of the measurer. Any measurement rotation angle and sampling number can be freely set, enabling higher precision measurements. Additionally, the measurement speed is fast, making it easy to establish 24-hour full automation in-line, thus eliminating the risk of injury from handling cutting tools. Automatic data storage of results, automatic judgment of good/bad products, and alert output in case of defects are also possible. 【Features】 ■ Non-contact measurement that does not damage the cutting edge ■ Measurement accuracy is consistent and does not depend on the skill of the measurer ■ Any measurement rotation angle and sampling number can be freely set ■ Automatic data storage of results and automatic judgment (good/bad) is possible ■ Automatic alert output in case of defects is possible ■ Easy to establish 24-hour full automation in-line *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

This product is a measuring device that automatically measures foreign substances on resin plates. Samples are manually loaded, and inspections are performed automatically. By using a high-speed, high-resolution camera and special dome lighting, it achieves overwhelming high precision and high reproducibility in a short time compared to conventional microscopic visual measurements with a high-precision CMOS camera. It also easily accommodates inline applications. 【Features】 ■ Samples are manually loaded, and inspections are executed automatically ■ Equipped with a high-speed, high-resolution camera and special dome lighting ■ Achieves overwhelming high precision and high reproducibility with a high-precision CMOS camera ■ Easily accommodates inline applications *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

This product is a compound wafer inspection device effective for inspecting internal micro-pipes, delamination, surface scratches, foreign substances, and polishing marks on SiC, GaN, and sapphire wafers up to 6 inches. It features four optical systems for inspection: super macro, differential interference, dark field, and transmission, all equipped with autofocus, allowing inspections to be conducted in the same coordinate system via an automatic stage. Optionally, AFM and wafer thickness measurement can also be added in the same coordinate system. 【Features】 - Equipped with four optical systems (super macro, differential interference, dark field, transmission) - All optical systems have autofocus functionality - Inspections can be performed in the same coordinate system using an automatic stage - Option to add AFM and wafer thickness measurement *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "Lens Appearance Inspection Device" is an inspection device that achieves overwhelming high precision and high reproducibility in a short time compared to conventional microscope visual measurements. Equipped with a high-speed, high-resolution camera and an innovative lighting system, it performs automatic inspections simply by manually setting the sample, accommodating a wide range from individual lenses to modules. It can detect foreign objects, scratches, and cracks, and can easily be adapted for inline use. 【Features】 ■ High-speed, high-resolution camera and innovative lighting system ■ Supports inspection of both individual lenses and modules ■ Capable of inspecting foreign objects, scratches, cracks, etc. ■ Automatically executes inspections after sample loading ■ Easily adaptable for inline use *For more details, please download the PDF or feel free to contact us.

• Visual Inspection Equipment

This product is a system that accurately distinguishes by registering a normal surface as a master and comparing it with inspection images. By comparing with the registered image, it detects foreign objects, scratches, dirt, and pattern defects attached to the image surface. It performs alignment deviation inspection and dimensional inspection using the display of the alignment pattern's position, measuring the area and size (maximum diameter) of foreign objects, and distinguishing between good and defective products. The inspection result data is filed and accumulated. Additionally, it allows for full surface movement inspection in conjunction with a prober (or XY stage) and automatic correction of positional deviations. 【Features】 - Automatic correction of positional deviations between master images and inspection images - Individual judgment conditions can be set for different screen areas (up to 10 specs) - Supports detection of foreign objects, scratches, dirt, and pattern defects, as well as dimensional inspection - Inspection result data is filed and saved - Full surface movement inspection in conjunction with a prober (or XY stage) *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The "Handa Fillet 3D Measurement Device" is a device that achieves high-speed measurement using a high-precision ultra-fast sensor based on the principle of chromatic aberration confocal technology. Since the incident light and the detected light follow the same path, shadowing can be ignored, allowing for accurate measurements even of complex shapes. It can measure without regard to the type of workpiece, including mirror surfaces, and can inspect large areas in a short time. It easily accommodates everything from tabletop models to fully automated inline systems, and a compact angled sensor version is also available. 【Features】 ■ Equipped with a high-precision ultra-fast sensor using the principle of chromatic aberration confocal technology ■ Can ignore shadowing and accurately measure complex shapes ■ Supports measurement of mirror workpieces ■ Allows for quick lens changes ■ Compatible with everything from tabletop models to fully automated inline systems *For more details, please download the PDF or feel free to contact us.

• 3D measuring device

The "Cylinder Inner Surface Appearance Inspection Device" is an automatic inspection device for cylindrical inner surfaces that enables reliable inspection for quantification and detection of missed defects, which are difficult to achieve through visual inspection. The camera moves in the XY direction and automatically determines OK/NG status for defects based on image recording and arbitrary threshold settings. It supports appearance inspections for scratches, foreign objects, and chips, reducing inspection time to about 1/10. It is also compatible with inline systems equipped with loaders and unloaders. 【Features】 ■ Fully automated appearance inspection for scratches, foreign objects, and chips ■ OK/NG determination based on arbitrary threshold settings ■ Inspection time reduced to about 1/10 ■ Compatible with inline systems equipped with loaders and unloaders *For more details, please download the PDF or feel free to contact us.

• Visual Inspection Equipment

The "AFL1" is an autofocus microscope that achieves high-speed operation at 0.2 seconds and focuses at sub-micron levels. The laser line tracing mode allows for high-precision tracking within the depth of focus. It can focus on transparent materials, patterns, and more, without being affected by the patterns. Its box-shaped design makes it easy to integrate into devices, and it supports image verification, teaching, and USB direct control with the AF-Mon software. 【Features】 ■ Instant focus adjustment by selecting magnification with an electric revolver ■ High-precision tracking within the depth of focus using laser line technology ■ High-precision autofocus function unaffected by patterns ■ Easy integration into devices with a box-shaped design ■ Image verification and teaching functions with AF-Mon software *For more details, please download the PDF or feel free to contact us.

• Other microscopes

This product is a device for the automatic measurement of end mills. It offers consistent measurement accuracy that does not depend on the skill of the operator, eliminating contact pressure, measurement angle, and parallax issues. Non-contact measurement is possible, preventing damage to the cutting edge and reducing the risk of injury from hazardous manual work. The measurement speed is also fast, making it easy to establish a fully automated inline system that operates 24 hours a day. Results can be automatically saved and evaluated (good/bad), and in the event of defects, automatic alert output is also possible. The measurement rotation angle and sampling number can be freely set, allowing for high-precision measurements. 【Features】 ■ Non-contact measurement prevents damage to the cutting edge ■ Measurement accuracy is consistent and does not depend on the operator's skill ■ Fully automated inline operation can be established for 24 hours ■ Automatic data saving and evaluation of results are possible ■ Automatic alert output function in case of defects *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

This product is a wafer internal crack inspection device that inspects internal cracks in the notch portion of semiconductor wafers using an SWIR camera. By utilizing an SWIR camera that can capture information not visible to the naked eye, it enables automatic data storage of inspection results, automatic classification of good/bad products, and alert output in the event of defects. Products inspected can be guaranteed for quality, and it accommodates everything from manual machines with hand loading to fully automated machines that operate 24 hours a day. 【Features】 ■ Inspects internal cracks in the notch portion of semiconductor wafers ■ Employs an SWIR camera capable of capturing information not visible to the eye ■ Enables automatic data storage and automatic classification of inspection results (good/bad) ■ Automatic alert output function in the event of defects ■ Accommodates everything from manual machines with hand loading to fully automated machines that operate 24 hours a day *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

The device is an automatic inspection system that can measure the area of ink marks stably with minimal influence from patterns. It uses a special optical system that brings out ink with stable detection capability for various wafer types. Measurement can be performed simply by setting the brightness values of the illumination and the binarization level for each wafer type, and it communicates with the prober via GPIB. Additionally, a device that operates with a dedicated XY stage instead of a prober can also be manufactured. 【Features】 ■ Special optical system that brings out ink for various wafer types ■ Stable measurement of ink mark area with minimal influence from patterns ■ Simple setup to determine the brightness values of the illumination and the binarization level ■ Automatic inspection possible via GPIB communication ■ A device with a dedicated XY stage can also be manufactured *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our autonomous transport robot, 'iSONA'. It is equipped with features such as an API interface, real-time monitoring, and expandability for peripheral devices, automating the transport processes in factories and logistics warehouses. Additionally, we offer an industry-leading energy-saving system, "VSP." It is recommended for those facing issues with equipment troubles caused by lightning strikes, natural disasters, or accidents involving power line facilities. 【Key Features (Partial)】 ■ Custom Mapping ■ Custom Modeling ■ Position Module ■ Navigation Module ■ Expandability for Peripheral Devices (Conveyor, Lift, Autonomous Driving) ■ Climbing Ability: Less than 7% (4°) ■ Autonomous Driving Target Accuracy: ±3mm (Note that errors may occur depending on road conditions) *For more details, please download the PDF or feel free to contact us.

• Transport and handling robots
• Other safety equipment

The "MR-200A" is a device that can measure the V-groove shape of the main roller and the wire height. After cleaning the roller set on the wire saw, the inspection device is attached to the core. The inspection device moves across the roller stage to measure all grooves, and the measurement values are saved as Excel and image files. 【Features】 ■ Inspect the groove depth without removing the roller from the machine and ensure it is not deeper than others when there is no wire. ■ Measure the wire height in a wound state to assess sinking. ■ Determine the criteria for roller replacement as a clue for quality improvement based on inspection results. ■ Conduct acceptance inspection after reprocessing the main roller. *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

"Momentary voltage dip" refers to a power outage that occurs for a very short time, instantaneously. Power companies generally refer to outages that last less than one minute in many cases. When a momentary dip occurs, it can lead to the stoppage or malfunction of factory equipment each time. Additionally, it can cause defects in the produced goods and take time to restart the equipment, resulting in decreased production efficiency. In the past, a momentary dip of 0.07 seconds caused enormous damages exceeding several billion yen for one company. [Handbook Contents] ■ What is a momentary dip ■ Difference between momentary dip (instantaneous voltage drop) and power outage ■ Effects of momentary dip ■ Countermeasures for momentary dip (instantaneous voltage drop) ■ Features of momentary dip protection device VSP *For more details, please refer to the PDF document or feel free to contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage dip" is a phenomenon where the voltage drops momentarily for a few cycles. It mainly continues until the fault in the transmission line caused by events such as lightning is removed from the power system, typically occurring within 0.5 seconds. Causes of momentary dips and power outages include "lightning," as well as "typhoons, storms," and "earthquakes," among others. [Causes of Momentary Dips & Power Outages] ■ Lightning ■ Typhoons, storms ■ Earthquakes ■ Heavy snowfall ■ Bird nesting ■ Damage to utility poles due to vehicle collisions *For more details, please refer to the PDF document or feel free to contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage sag" refers to a brief, instantaneous drop in voltage. The countermeasure device has shifted from UPS (Uninterruptible Power Supply) to VSP (Voltage Sag Protector)! VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for SAG (momentary voltage sag). Common incidents and troubles in the data center industry caused by momentary voltage sags due to lightning and other factors: ■ The cooling system's pump has stopped. ■ The backup for the server has failed. ■ Cloud outages have occurred. Success stories from the introduction of momentary voltage sag protection devices: ■ The cooling system's pump has not stopped. ■ The backup for the server has not failed. ■ The frequency of outages has decreased. *For more details, please download the materials or contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage drop" refers to a brief, instantaneous decrease in voltage. Countermeasure devices have transitioned from UPS (Uninterruptible Power Supply) to VSP (Voltage Sag Protector)! The VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for SAG (momentary voltage drops). Accidents and troubles frequently caused by momentary voltage drops due to lightning in the semiconductor, wafer, and FPD industries include: ■ Occurrence of defects in semiconductor manufacturing equipment (decreased yield) ■ Delays in semiconductor production schedules (delivery delays) ■ Increased costs due to product defects and equipment startup time losses ■ Decreased reliability among stakeholders Success stories from the introduction of momentary voltage drop protection devices: ■ Improved stability of semiconductor quality ■ Maintenance-free operation of equipment, with a lifespan of 13 to 15 years ■ Landing costs reduced to as low as one-twelfth, resulting in energy savings ■ Low introduction costs ■ Small footprint allows for effective use in clean rooms ■ No harmful substances used *For more details, please download the materials or contact us.

• UPS/Uninterruptible Power Supply

This is a main roller groove shape inspection machine for wire cutting machines. The inspection device can be placed on the roller at the site to measure the groove shape profile and capture images of the shape. ■ Features 1. Regular maintenance of the main roller allows for checking wear and shape abnormalities. 2. It can estimate the timing for roller replacement and monitor the wire position. 3. It can manage the acceptance inspection of new rollers and optimal processing conditions. ■ Inspection Details 1. Main roller groove shape mode, ear mode, and manual mode. 2. It can perform groove inspections for solar panels and semiconductor grooves.

• Semiconductor inspection/test equipment

The diamond section has a higher bonding strength compared to the core section. When the workpiece is pressed against it, the core section wears out faster. The diamond section, which is approximately 10 microns higher (depending on the diamond grain size), will always be in contact with the workpiece. The size of the core section and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution of the diamond against the workpiece, thus maximizing the power of the grinding wheel. <Features> - Ideal cutting performance and grinding wheel lifespan with the size and thickness of the honeycomb! - The abrasive grains in the core section enhance processing efficiency due to the action of free abrasive grains. - Maximizes non-dress and dress intervals. - Load distribution can be controlled through diamond patterning.

• Other abrasives

This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board

• Visual Inspection Equipment

Since the establishment of the company in 1986, we have been developing semiconductor equipment-related businesses that support Japan's cutting-edge technology, and we possess various repair know-how related to semiconductor manufacturing equipment. This time, we would like to introduce laser repairs for stepper devices. We can accommodate ASML, Nikon, and Canon products. (Please download the materials for a detailed list.)

• Semiconductor inspection/test equipment

At Arrows Engineering, we handle MEMS microscopes manufactured by IT Tech. The "TMIR-2000" can monitor MEMS wafers from both sides using microscope cameras, allowing for pattern misalignment and misregistration inspections. With newly developed software, the optical axes of the two cameras are aligned and synthesized in real-time, directly capturing any vertical overlap misalignment. Additionally, automatic line width measurement allows for sub-micron measurement of mark misalignment. 【Basic Configuration (Excerpt)】 ■ MEMS Microscope Main Unit ■ Triple Eyepiece Tube ■ 10x Eyepiece ■ XY Stage ■ Two Color Cameras ■ Inspection PC/19-inch Monitor/MEMS Inspection Software, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

At Arrows Engineering, we handle the "Automatic Infrared Microscope" manufactured by IT Tech. This product performs image measurements of the pattern dimensions inside silicon using an infrared microscope, focusing visibly with AF on the surface of 8” bonded wafers. It is equipped with 2 cassettes, an edge grip chuck, and an edge aligner. 【Features】 ■ Target wafer: 8” ■ 2 cassettes ■ Positioning accuracy: ±1μm ■ Axis offset measurement: ±0.5μm ■ Line width measurement: 0.2μm *For more details, please refer to the PDF document or feel free to contact us.

• Other microscopes

At Arrows Engineering, we handle the AR film defect inspection equipment manufactured by IT Tech. The 'EX2001S' is a defect inspection machine for anti-reflective films on glass substrates. It performs high-speed scan inspections of the surfaces and backs of transparent substrates using an inverted microscope and line camera to detect defects. 【Features and Functions】 - The maximum substrate size is 400mm, with auto-focus inspection for transparent substrates. - Detected defects include white foreign matter (gaps) and black foreign matter on the AR film substrate. - Minimum detection resolution is 2.8μm (1.4μm). - Review inspections can be remotely controlled (camera/lighting/objective magnification/stage and focus). *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for voltage sags (momentary voltage drops). It detects and backs up within just 0.001 seconds from the occurrence of a sag. With a rich lineup of 28 series, all models are equipped with electric double-layer supercapacitors (EDLS). 【Features】 ○ Maintenance-free ○ Ultra-fast switching time ○ Lightweight, compact, silent, and safe ○ Momentary sag history monitor ○ Bypass function For more details, please contact us or download the catalog.

• UPS/Uninterruptible Power Supply

The voltage sag protector can be applied in various industrial fields, including semiconductors, LCDs, automotive, chemicals, and medical sectors. Unlike traditional uninterruptible power supply (UPS) systems that use battery storage for uninterruptible power supply, it can completely resolve various power issues within one second of an instantaneous power outage. It can reduce the electricity consumption of existing devices by 80%. 【Features】 ■ Suitable for countermeasures against instantaneous power outages and voltage drops caused by lightning, ice and snow, and typhoons. ■ Maintenance-free due to the use of long-life electric double-layer capacitors. ■ Normally uses commercial power supply, switching instantly to electric double-layer capacitors for backup during momentary dips. ■ Achieves low power consumption due to high efficiency. *For more details, please request materials or view the PDF data from the download section.

• Circuit breakers and switches

The Line Camera Mini Series is a low-noise, high-sensitivity monochrome line camera that features a sensor with a pixel count of 512 to 2048, a sampling rate of 40 MHz, and a pixel size of 14×14 μm, along with a GRIN lens. It supports Camera Link output and is suitable for various inspection applications. 【Features】 ○ Continuous imaging of flowing workpieces ○ Compact design with integrated lens ○ Capable of close-up shooting at short distances ○ High-speed, high-precision scanning For more details, please contact us or download the catalog.

• Monochrome camera

The "close-up line camera" is a compact line camera for image inspection, designed for easy integration into production lines. It is ideal for detecting scratches, dust, and foreign objects on substrates and thin products flowing on conveyors. A single line camera can scan wide workpieces. It contributes to low-cost, high-speed, and high-precision inspections. 【Features】 - Compact structure for easy close installation and integration - Supports a variety of reading widths - High-speed reading - High-precision reading For more details, please contact us or download the catalog.

• Monochrome camera

The digital microscope "SDM2" is a fully automatic digital microscope system that can observe a wide range from low to high magnification. By using a high-resolution zoom microscope, it is also possible to observe with an optical resolution of less than 1μm. It can quickly move to registered coordinates using an automatic XY stage. Additionally, it is equipped with an autofocus function, achieving high resolution that cannot be realized with conventional zoom microscopes. For more details, please download the catalog.

• Electron microscope

The "PSI-50" is an inspection device capable of measuring the outer shape of small glass substrates and panels with high precision. It can measure outer dimensions (maximum width), detect burrs, detect chips, check for cutting misalignment, and measure the dimensions of the glass pouring area. Additionally, it is equipped with a measurement map display function and image saving capabilities. The automatic angle correction feature means that there is no need to precisely align the workpiece when placing it on the inspection stage. Once installed, it automatically corrects the angle. If the placed angle is too large, it will affect measurement accuracy, so it is designed to display an alarm. [Features] ■ Equipped with measurement map display function ■ Equipped with image saving function ■ Comes with automatic correction function *For more details, please refer to the catalog or feel free to contact us.

• Circuit Board Inspection Equipment

The "ITO Film Appearance Inspection Device" is a device that measures the line width of transparent films on film or glass substrates and conducts appearance inspections. By using a special optical system, it can clearly capture the presence or absence of transparent patterns, such as ITO films on touch panels, and detect splashes for appearance measurement. It is capable of inspecting the entire film at high speed and allows for detailed review observation of defect areas using high-magnification optics. Additionally, as an option, it can quickly measure the size and distribution of foreign substances on the substrate. Customization of inspection range and measurement accuracy is also possible upon request, so please feel free to consult us. 【Features】 ■ High-speed inspection possible ■ Review observation available ■ Customizable *For more details, please refer to the catalog or feel free to contact us.

• Defect Inspection Equipment

The "Seal Gap Measurement Device" is a measuring device that can quickly measure the gap dimensions between the seal area and the BM area of LCD glass panels. Conveyance is done through continuous movement, and a CCD camera is used to capture still images with a strobe light, allowing for high-speed and stable measurements with inexpensive conveyance machinery. The device employs a telecentric lens, ensuring that measurement accuracy is guaranteed even if the distance between the lens and the workpiece varies slightly due to warping or other factors. Additionally, there is almost no precision error based on the location within the image. 【Features】 ■ Capable of high-speed measurement ■ Capable of stable measurement ■ Uses telecentric lens *For more details, please refer to the catalog or feel free to contact us.

• Defect Inspection Equipment

The "Wire Bonding Inspection Device" is an optimal inspection device for specifying inspection positions and conducting test measurements with set parameters. It displays images of ideal samples taken, allowing for easy specification of inspection positions and test measurements through simple mouse operations. Results such as wire trajectories are visually displayed, making verification easy. Additionally, variety information is recorded on the HDD, allowing for the registration of multiple varieties. [Features] - Optimal for test measurements of parameters - Simple mouse operation - Results such as wire trajectories can be visually displayed *For more details, please refer to the catalog or feel free to contact us.

• Bonding Equipment

The "Transparent Film Inspection Certification Device" is a device that allows for high-contrast direct visual or camera observation of patterns such as transparent films formed on transparent glass. It generates a backlight effect that uniformly diffuses light on the surface of the glass substrate beyond the critical angle, causing the edges to not appear white when compared to dark field illumination. Additionally, by incorporating coaxial reflected lighting with adjusted light intensity, it suppresses the scattered surface reflections of the transparent glass part, enhancing the halation effect that increases the reflectivity of areas without the transparent film due to the transmission effect. Furthermore, it is possible to enhance the contrast that darkens the pattern of the transparent electrode with backlighting. 【Features】 ■ Equipped with a lighting device ■ Easy to operate ■ High precision *For more details, please refer to the catalog or feel free to contact us.

• Optical microscope

The high-precision wafer crack inspection device "Super Macro SM75" can inspect 300mm wafers in less than one second with a full-field one-shot, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of small-field optical systems and can be applied to internal void inspections by using infrared light as an optional light source. In recent years, wafers have been becoming thinner, but this high-precision wafer crack inspection device can quickly inspect the entire wafer for chip cracks caused by the unevenness of BG processing, polishing marks, and stress. For more details, please download the catalog.

• Electron microscope

The atomic force microscope "Handy AFM" can be used as a substitute for high-magnification optical microscopes. It features standard measurement modes, including static force mode, dynamic force mode, phase contrast, phase measurement, force modulation, spreading resistance, and external input capabilities. The scanning head is available in two types: high-resolution and wide-area, and they can be exchanged instantly. Probe replacement takes only a few seconds, and no adjustments are needed after replacement. Additionally, carbon nanotube probes can also be approached automatically. By using an electromagnetic scanner (patented) for scanning, there is no need to move the workpiece during the scan. Generally, it does not exhibit the non-linear creep or aging changes associated with piezo devices commonly used in AFMs. Optionally, it can be combined with a compact automatic stage. For more details, please download the catalog.

• Electron microscope

The atomic force microscope "AFM with stage" is the only microscope capable of non-destructive three-dimensional measurements down to the nanometer scale in the atmosphere. It allows measurements without damaging the sample. By using an electromagnetic scanner, stable long-term measurements can be achieved without worrying about non-linear creep or aging effects. With a large stage, it is possible to perform non-destructive measurements simply by setting the sample without cutting the workpiece. Various measurement modes are available, providing functions equivalent to expensive AFM devices. Regardless of the material of the measurement work, measurements at the nano level can be performed immediately, from conductors to insulators, without any coating. For more details, please download the catalog.

• Electron microscope

The ultra-compact active vibration isolation table "Nano Series" is a cutting-edge, high-performance vibration isolation table that constantly senses vibrations and controls them through electronic means. It offers vibration isolation performance that far exceeds any high-end passive isolation table using air springs, all while saving space. It creates an optimal vibration environment for ultra-precise measurements at "nano size and below." It features ultra-high-performance sensors with six degrees of freedom active control. Additionally, soundproof and shockproof boxes are available as options. For more details, please download the catalog.

• Vibration Monitoring

The "Sheet Resistance Measurement Device" equipped with an optical stopper function can measure the surface resistance distribution at fine intervals (sub-micron to several tens of microns) using a micro four-terminal probe. By narrowing the functionality to applications in next-generation research and development, it achieves a low price while enabling resistance distribution measurement in fine areas of thin film surfaces in electronic devices. The optical stopper function is standardly equipped, stopping any pressing beyond a certain level even when there is no current, thus protecting the probe. For more details, please download the catalog.

• Vibration Monitoring

Easy operation: The "Automatic Winding Displacement Inspection System" automatically inspects the winding condition of the electrodes inside the battery using X-ray image processing. It individually recognizes the electrode numbers of the positive and negative electrodes and automatically measures their quantity and displacement. Two image processing devices work in pairs, inputting X-ray images individually to simultaneously inspect the top and bottom of the battery in-line. For more details, please download the catalog.

• Vibration Monitoring