Achieving high-speed, high-precision inspection of the floating solder part of the wire! Products equipped with high-precision sensors that can handle mirror surfaces and complex shapes.
The "Floating Inspection Measurement Device" is a product that performs floating inspection of the soldered parts of wires with high speed and precision. By measuring the crushed height, it conducts electrical non-conductivity inspections. Using a high-precision ultra-high-speed sensor based on the principle of chromatic aberration confocal, it can measure at a speed of 36,000 lines per second, with 1,200 measurement points per line. The measurement accuracy is ±2μm. Since the incident light and detection light of the sensor follow the same path, shadowing can be ignored, allowing for accurate measurements even on complex shapes and mirror surfaces. Furthermore, it can also inspect and measure other features such as step differences, foreign objects, scratches, protrusions, and film thickness over large areas in a short time. It can easily accommodate everything from tabletop machines to fully automated 24-hour inline systems. 【Features】 ■ High-speed and high-precision floating inspection of the soldered parts of wires ■ Inspection of electrical non-conductivity through crushed height measurement ■ Accurate measurement of mirror surfaces and complex shaped workpieces ■ Compatible with everything from tabletop machines to fully automated 24-hour inline systems *For more details, please download the PDF or feel free to contact us.
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basic information
【Specifications】 ■ Configuration (example): Electric X・Y stage, manual Z stage, fixture for sample holding, optical system mounting frame, computer for measurement and control, dedicated objective lens group, motor control board, LCD display ■ Measurement speed (lines per second): 3600 ■ Line length: 2.36 mm to 11.9 mm (lens change) ■ Measurement range (Z direction): 0.68 m to 10.6 m (lens change) ■ Numerical aperture (NA): 0.77 to 0.22 (lens change) ■ Number of measurement points per line: 1200 ■ Z direction resolution: 0.8μm (lens change) ■ Measurable angle: 90°±50° to ±13° (lens change) ■ Weight: Approximately 6.2kg (sensor part) ■ Dimensions: 346 × 185 × 135mm (sensor part) *For more details, please download the PDF or feel free to contact us.
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【Applications】 ■ Inspection of solder joints on wires ■ Inspection for electrical non-conductivity ■ Measurement inspection of steps, foreign objects, scratches, protrusions, film thickness, etc. ■ Measurement of mirror surfaces and complex-shaped workpieces ■ Tabletop and fully automatic 24-hour inline inspection *For more details, please download the PDF or feel free to contact us.
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Company information
Since our company's establishment in 1986, we have long been engaged in semiconductor-related businesses that support Japan's cutting-edge technology. On the hardware side, we have developed construction and manufacturing environments, including clean rooms. On the human resources side, we have focused on training semiconductor engineers and establishing a service system that can promptly respond to customer needs. Last year, we participated in SEMICON Japan for the first time, and by directly interacting with many industry stakeholders, we were able to learn again what is currently needed and what services should be created. At the same time, the morale within the company has been rising, and we are actively conducting sales activities. It is said that the Japanese economy is finally showing signs of recovery. However, even just looking at the semiconductor industry, the entry of overseas manufacturers and the significant improvement in technology and services are remarkable, so we aim to enhance our international competitiveness in our sales expansion. Not only domestically but also in response to the era of globalization, our role as a hub connecting North America and Asia, especially given our excellent airport access, will further increase.
