アローズエンジニアリング Product Lineup

The device is an automatic inspection system that can measure the area of ink marks stably with minimal influence from patterns. It uses a special optical system that brings out ink with stable detection capability for various wafer types. Measurement can be performed simply by setting the brightness values of the illumination and the binarization level for each wafer type, and it communicates with the prober via GPIB. Additionally, a device that operates with a dedicated XY stage instead of a prober can also be manufactured. 【Features】 ■ Special optical system that brings out ink for various wafer types ■ Stable measurement of ink mark area with minimal influence from patterns ■ Simple setup to determine the brightness values of the illumination and the binarization level ■ Automatic inspection possible via GPIB communication ■ A device with a dedicated XY stage can also be manufactured *For more details, please download the PDF or feel free to contact us.

This product is a wafer internal crack inspection device that inspects internal cracks in the notch portion of semiconductor wafers using an SWIR camera. By utilizing an SWIR camera that can capture information not visible to the naked eye, it enables automatic data storage of inspection results, automatic classification of good/bad products, and alert output in the event of defects. Products inspected can be guaranteed for quality, and it accommodates everything from manual machines with hand loading to fully automated machines that operate 24 hours a day. 【Features】 ■ Inspects internal cracks in the notch portion of semiconductor wafers ■ Employs an SWIR camera capable of capturing information not visible to the eye ■ Enables automatic data storage and automatic classification of inspection results (good/bad) ■ Automatic alert output function in the event of defects ■ Accommodates everything from manual machines with hand loading to fully automated machines that operate 24 hours a day *For more details, please download the PDF or feel free to contact us.

The "Cylinder Inner Surface Appearance Inspection Device" is an automatic inspection device for cylindrical inner surfaces that enables reliable inspection for quantification and detection of missed defects, which are difficult to achieve through visual inspection. The camera moves in the XY direction and automatically determines OK/NG status for defects based on image recording and arbitrary threshold settings. It supports appearance inspections for scratches, foreign objects, and chips, reducing inspection time to about 1/10. It is also compatible with inline systems equipped with loaders and unloaders. 【Features】 ■ Fully automated appearance inspection for scratches, foreign objects, and chips ■ OK/NG determination based on arbitrary threshold settings ■ Inspection time reduced to about 1/10 ■ Compatible with inline systems equipped with loaders and unloaders *For more details, please download the PDF or feel free to contact us.

This product is a system that accurately distinguishes by registering a normal surface as a master and comparing it with inspection images. By comparing with the registered image, it detects foreign objects, scratches, dirt, and pattern defects attached to the image surface. It performs alignment deviation inspection and dimensional inspection using the display of the alignment pattern's position, measuring the area and size (maximum diameter) of foreign objects, and distinguishing between good and defective products. The inspection result data is filed and accumulated. Additionally, it allows for full surface movement inspection in conjunction with a prober (or XY stage) and automatic correction of positional deviations. 【Features】 - Automatic correction of positional deviations between master images and inspection images - Individual judgment conditions can be set for different screen areas (up to 10 specs) - Supports detection of foreign objects, scratches, dirt, and pattern defects, as well as dimensional inspection - Inspection result data is filed and saved - Full surface movement inspection in conjunction with a prober (or XY stage) *For more details, please download the PDF or feel free to contact us.

The "MPI-300A" is a main roller groove inspection machine that can capture, record, and measure the entire length of groove shapes through profile cross-section imaging and electric scanning. The transmitted light from the profile camera creates a shadow cross-section of the roller, which is captured by a telecentric lens camera as it moves along the entire length of the roller, allowing for frame recording and image measurement. It is designed to be set next to the slicer on a cart for easy adjustment and inspection. 【Features】 - Capable of capturing, recording, and measuring the entire length through profile cross-section imaging and electric scanning - Supports inspection of slicer-mounted rollers and wire mode - Easily adjustable when set next to the slicer on a cart - Can be used as data for wear inspection, durability monitoring, and determining roller replacement timing *For more details, please download the PDF or feel free to contact us.

The "Lens Appearance Inspection Device" is an inspection device that achieves overwhelming high precision and high reproducibility in a short time compared to conventional microscope visual measurements. Equipped with a high-speed, high-resolution camera and an innovative lighting system, it performs automatic inspections simply by manually setting the sample, accommodating a wide range from individual lenses to modules. It can detect foreign objects, scratches, and cracks, and can easily be adapted for inline use. 【Features】 ■ High-speed, high-resolution camera and innovative lighting system ■ Supports inspection of both individual lenses and modules ■ Capable of inspecting foreign objects, scratches, cracks, etc. ■ Automatically executes inspections after sample loading ■ Easily adaptable for inline use *For more details, please download the PDF or feel free to contact us.

This product is a compound wafer inspection device effective for inspecting internal micro-pipes, delamination, surface scratches, foreign substances, and polishing marks on SiC, GaN, and sapphire wafers up to 6 inches. It features four optical systems for inspection: super macro, differential interference, dark field, and transmission, all equipped with autofocus, allowing inspections to be conducted in the same coordinate system via an automatic stage. Optionally, AFM and wafer thickness measurement can also be added in the same coordinate system. 【Features】 - Equipped with four optical systems (super macro, differential interference, dark field, transmission) - All optical systems have autofocus functionality - Inspections can be performed in the same coordinate system using an automatic stage - Option to add AFM and wafer thickness measurement *For more details, please download the PDF or feel free to contact us.

This product is a measuring device that automatically measures foreign substances on resin plates. Samples are manually loaded, and inspections are performed automatically. By using a high-speed, high-resolution camera and special dome lighting, it achieves overwhelming high precision and high reproducibility in a short time compared to conventional microscopic visual measurements with a high-precision CMOS camera. It also easily accommodates inline applications. 【Features】 ■ Samples are manually loaded, and inspections are executed automatically ■ Equipped with a high-speed, high-resolution camera and special dome lighting ■ Achieves overwhelming high precision and high reproducibility with a high-precision CMOS camera ■ Easily accommodates inline applications *For more details, please download the PDF or feel free to contact us.

The device is an automatic measurement system that enables quality assurance after inspection. It allows for non-contact measurement, preventing damage to the cutting edge, and eliminates issues such as contact pressure, measurement angle, and parallax, which depend on the skill of the measurer. Any measurement rotation angle and sampling number can be freely set, enabling higher precision measurements. Additionally, the measurement speed is fast, making it easy to establish 24-hour full automation in-line, thus eliminating the risk of injury from handling cutting tools. Automatic data storage of results, automatic judgment of good/bad products, and alert output in case of defects are also possible. 【Features】 ■ Non-contact measurement that does not damage the cutting edge ■ Measurement accuracy is consistent and does not depend on the skill of the measurer ■ Any measurement rotation angle and sampling number can be freely set ■ Automatic data storage of results and automatic judgment (good/bad) is possible ■ Automatic alert output in case of defects is possible ■ Easy to establish 24-hour full automation in-line *For more details, please download the PDF or feel free to contact us.

The "WEIM-12F" is a fully automatic profiler inspection machine compatible with FUPE, capable of high-precision and high-speed automatic measurements. It retrieves wafers using a robot with a double-hand inversion mechanism, aligns them, and then measures wafer thickness, diameter, notch, and profiler measurements before storing them. It is a system that allows inline management via MELCEC-net communication. 【Features】 ■ High-precision, high-speed automatic measurements ■ Two laser displacement meters measure the thickness at the center and outer edge of the wafer ■ Two width and diameter measurement devices measure the outer diameter of the wafer using the diameter method ■ Two optical cameras measure the notch and notch displacement of glass/Si from both sides *For more details, please download the PDF or feel free to contact us.

The "Floating Inspection Measurement Device" is a product that performs floating inspection of the soldered parts of wires with high speed and precision. By measuring the crushed height, it conducts electrical non-conductivity inspections. Using a high-precision ultra-high-speed sensor based on the principle of chromatic aberration confocal, it can measure at a speed of 36,000 lines per second, with 1,200 measurement points per line. The measurement accuracy is ±2μm. Since the incident light and detection light of the sensor follow the same path, shadowing can be ignored, allowing for accurate measurements even on complex shapes and mirror surfaces. Furthermore, it can also inspect and measure other features such as step differences, foreign objects, scratches, protrusions, and film thickness over large areas in a short time. It can easily accommodate everything from tabletop machines to fully automated 24-hour inline systems. 【Features】 ■ High-speed and high-precision floating inspection of the soldered parts of wires ■ Inspection of electrical non-conductivity through crushed height measurement ■ Accurate measurement of mirror surfaces and complex shaped workpieces ■ Compatible with everything from tabletop machines to fully automated 24-hour inline systems *For more details, please download the PDF or feel free to contact us.

The "Back Surface Crack Inspection Device" is an automatic inspection device for ceramic substrates that can be easily constructed for 24-hour inline automation. It detects fine cracks that are difficult to see with the naked eye using image processing with special lighting from two directions. The non-contact inspection measurement prevents damage to the workpiece, and the fast measurement speed is an advantage. Results are automatically saved as data, and automatic judgment of good and defective products is performed, with support for alert output in case of defects. Products inspected can be guaranteed for quality. The device can be constructed with any desired takt time and inspection accuracy. 【Features】 ■ Detection of fine cracks using special lighting from two directions and image processing ■ Non-contact inspection measurement that does not damage the workpiece ■ Automatic data saving and automatic judgment of results (good/defective) ■ Automatic alert output in case of defects ■ Construction possible with any desired takt time and inspection accuracy *For more details, please download the PDF or feel free to contact us.