3D Implementation TSV Processing Technology (MEMS)
3D Implementation TSV Processing Technology (MEMS)
Realization of high functionality through high integration devices. 3D packaging (stacked chip) processing technology.
This is an introduction to 3D implementation TSV processing technology (MEMS). MEMS refers to micro-meter-sized mechanical components, sensors, actuators, electronic circuits, and controllers that are integrated into a micro-electromechanical system. It is manufactured using micromachining technology that applies semiconductor processes. Conventional semiconductor manufacturing processes are primarily used for forming two-dimensional shapes, while three-dimensional shapes are created using techniques such as sacrificial layer etching and self-formation. Practical applications have been realized in inkjet printer heads, DMD projectors, pressure sensors, accelerometers, RF components, and applications are beginning in a wide range of fields including automobiles, airplanes, biotechnology, medical, information communication, and robotics. For more details, please contact us or download the catalog.
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【Main Features】 ○ Manufactured using micromachining technology applied from semiconductor processes ○ Techniques such as sacrificial layer etching and self-formation are utilized ○ Applications in a wide range of fields have begun → Practical applications include inkjet printer heads, DMD projectors, pressure sensors, accelerometers, RF components, etc., in industries such as automotive, aviation, biotechnology, medical, information communication, and robotics ○ 3D packaging using TSV (Through-Silicon Via) → Includes through-hole dry etching on silicon wafers, low-temperature insulating film formation on via sidewalls, seed layer formation for via plating, embedding conductors with plating inside vias, CMP flattening, Cu post formation, Sn/Ag solder reflow, and thinning of wafers ○ Cost reductions in each process are expected to accelerate the practical application of TSV ● For more details, please contact us or download the catalog.
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Until now, innovations and discoveries that have served as driving forces have led to industrial innovation and economic development. This has been achieved through the development of mass production technologies for automobiles, computer technologies, semiconductor technologies, internet technologies, and environmental technologies, continuously creating innovations and sustaining economic growth. Global Net operates with the philosophy of providing new information through publishing, seminars, and wafer processing businesses to ensure that innovation continues uninterrupted. In modern times, information is overflowing, making it difficult to obtain truly necessary information. Furthermore, the value of necessary information lies in its timely acquisition. Global Net Corporation (commonly known as GNC) was established with the aim of disseminating necessary information in a timely manner.