グローバルネット株式会社 Product Lineup

Introducing Global Net's "GNC Publishing and Information Services." We offer various publications, including the "World Semiconductor Manufacturing Equipment and Test/Inspection Equipment Market Yearbook 2019," which provides insights into the market shares of semiconductor manufacturing and testing equipment companies by region, as well as the "World Semiconductor Factory Yearbook 2018," which covers the production systems of global semiconductor manufacturers and the status of their factories and lines. 【Lineup】 ■ World Semiconductor Manufacturing Equipment and Test/Inspection Equipment Market Yearbook 2019 ■ World Organic EL Display Industry Yearbook 2019 ■ World Semiconductor Factory Yearbook 2018 ■ World Semiconductor Industry Strategic Partnership MAP 2019 ■ Analysis Report on Substrates for Electronic Devices and CMP-Related Markets 2019 *For more details, please refer to the PDF materials or feel free to contact us.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment
• Other semiconductors

At Global Net Co., Ltd., we provide services such as GNC processing foundry and GNC patterned wafer services. We mainly offer processing services for silicon wafers, glass, and other materials tailored to our customers' needs. We are capable of providing integrated production from substrate arrangement to mask design. 【Business Overview】 ■ GNC Processing Foundry - Film deposition foundry - Process evaluation ■ GNC Patterned Wafer Services - GNC fine patterned wafers - GNC advanced CMP evaluation patterned wafers - GNC MEMS and silicon special processing services ■ GNC 2.1D/2.5D/3D Solutions - Bump wafer and redistribution processing / FOWLP process services *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

This is an introduction to 3D implementation TSV processing technology (MEMS). MEMS refers to micro-meter-sized mechanical components, sensors, actuators, electronic circuits, and controllers that are integrated into a micro-electromechanical system. It is manufactured using micromachining technology that applies semiconductor processes. Conventional semiconductor manufacturing processes are primarily used for forming two-dimensional shapes, while three-dimensional shapes are created using techniques such as sacrificial layer etching and self-formation. Practical applications have been realized in inkjet printer heads, DMD projectors, pressure sensors, accelerometers, RF components, and applications are beginning in a wide range of fields including automobiles, airplanes, biotechnology, medical, information communication, and robotics. For more details, please contact us or download the catalog.

• Technical and Reference Books

A thin plate made of semiconductor used in the manufacturing of IC chips. Most are made of silicon, which is specifically called "silicon wafer." The wafer is a disk created by crystallizing the raw material into a cylindrical shape called an "ingot," with a diameter of approximately 120mm to 200mm, and then slicing it thinly to about 0.5mm to 1.5mm. Wafers with diameters of 8 inches (200mm) and 12 inches (300mm) are commonly used. IC chips are manufactured by imprinting circuit patterns onto the wafer.

• Technical Seminar
• Other metal materials

Please feel free to consult us regarding the dispatch of instructors for technical seminars aimed at employees, the creation of seminar programs, etc. We will listen to your requests and prepare a quote.

• Technical Seminar