Pursuing high-speed detection and inline compatibility for solder joint inspection such as BGA!
Inspection of double-sided mounted substrates, which was difficult to distinguish with conventional transmission X-ray inspection systems, can now be achieved quickly. Additionally, by specializing in inline processing, we provide an affordable and compact machine.
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basic information
◆Industry-leading high-speed detection performance ◆Specialized in BGA defect inspection and inline processing ◆Compact housing *For more details, please refer to 'Catalog Download' or 'Contact Us'!*
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Applications/Examples of results
◆ For inspecting double-sided mounted circuit boards that cannot be confirmed with conventional transmission X-ray inspection machines ◆ For integration into existing assembly lines
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Company information
Our company was established in 1907 (Meiji 40) with the aim of manufacturing and selling the Toyoda loom invented by Sakichi Toyoda. We have continued our business activities amid a rapidly changing era, marking a century of history since our founding. The machinery and inspection equipment we provide leverage the manufacturing know-how we have cultivated over many years, and by integrating our unique technology with the latest high-tech parts, we contribute significantly to the electronics industry.