豊和工業 Product Lineup

The Ceramic Green Sheet Temporary Stacking Machine (Pin Lamination Type) PLM-200HW achieves a stacking accuracy of ±5μm! It features high-precision alignment using a CCD camera and includes a high-precision reference hole punching function, while a new lighting technology eliminates partial color unevenness. 【Features】 ■ High-precision alignment using a CCD camera Alignment with four 2-megapixel CCD cameras ■ Equipped with a high-precision reference hole punching function Minimizes sheet stretching during pressing ■ Precision pressing with a servo hydraulic circuit Enables high-precision pressing through pattern pressure and vacuum pressing *For more details, please download the catalog or feel free to contact us.

• Other processing machines

We offer a wide variety of options, including a double press type that achieves high productivity and a gold frame compatible type that enables high-precision layering. We also respond to customization requests based on customer needs.

• Other processing machines

By adopting a piezoelectric actuator as the drive source for punching, we have achieved the industry's fastest hit rate. *This machine is designed for ceramic green sheets, but it can also perform high-speed, high-precision, and high-quality drilling on thin film materials! We can customize it for applications other than ceramic green sheets as well.

• Other processing machines

Inspection of double-sided mounted substrates, which was difficult to distinguish with conventional transmission X-ray inspection systems, can now be achieved quickly. Additionally, by specializing in inline processing, we provide an affordable and compact machine.

• X-ray inspection equipment

The usual tact time of 12 seconds has been reduced to an incredible 9 seconds! When converted to a minute, this allows for an increase in production of 1 to 2 more units compared to before.

• Electron beam lithography equipment
• Other semiconductor manufacturing equipment
• Resist Device

Our unique system performs exposure with the substrate in an upright position, eliminating yield loss due to debris issues.

• Circuit board processing machine
• Other semiconductor manufacturing equipment