Stress analysis case studies: temperature cycle, vibration, drop impact simulation.

We will not only provide temporary measures for the products with issues but also assist in reducing the development loss costs for the next development products!

In the "Temperature Cycle Simulation," we conduct simulations considering the package structure to predict lifespan and propose improvements aimed at optimizing reliability. In the "Vibration Simulation," we analyze factors based on the product's mounting conditions (such as deformation of the housing during screw fastening) and provide proposals for countermeasures. In the "Drop and Impact Simulation," we perform factor analysis based on stress distribution using simulation techniques that consider the package structure and propose countermeasures. With our proven track record of collaboration with semiconductor vendors, we have a deep understanding of package structures, which we leverage to ensure consistency between simulations and actual measurements. We offer proposals for optimizing reliability based on the extensive knowledge of our specialized engineers in simulation, implementation, evaluation, and housing design. For more details, please download the catalog or contact us.

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