Case Study: Thermal Analysis (Thermal Simulation)

Reduce product costs with high-precision thermal property analysis! (Thermal simulation)

Are you increasing product costs to ensure product design reliability? If optimal thermal measures are not taken, excessive measures will reduce market competitiveness, while insufficient measures will increase development costs. However, by optimizing temperature margin design, total costs can be reduced (thermal simulation). Our unique method features localized heating of specific parts of the chip, with measurements taken at the PN junction (specific) within the heated area. Additionally, by constructing a simulation model that fits the measurement results, the entire system product can be temperature-predicted using simulation technology. We also offer consulting services, including the creation of libraries and the establishment of rules for heat dissipation measures and thermal management. For more details, please download the catalog or contact us.

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