Temperature control of flow ovens and reflow ovens: Reducing solder adhesion defects and improving efficiency!
Predicting temperature rise in reflow and flow furnaces through simulation! Aiming to reduce solder adhesion defects and improve the efficiency of the assembly process.
Soldering is a traditional technology, but due to environmental pollution measures (RoHS directive), lead-free solder with different characteristics from the previously mainstream lead solder has started to be used. This, along with requests from product development, has necessitated a review of manufacturing conditions and methods. To manufacture higher quality products, it is essential to anticipate potential issues in the manufacturing process from the development stage and to establish countermeasures. This is where thermal simulation technology is gaining significant attention! For customers who already have experience or technology in thermal simulation, we offer solutions centered around the introduction of tools such as FloTHERM and FloTHERM PCB. For customers without experience in thermal simulation who need to build their technology, we propose solutions focused on thermal design consulting. Thermal simulation related to soldering can yield significantly different results depending on the solder material, electronic components, and manufacturing conditions, so it is not possible to universally present the best conditions. We will propose solutions that can provide results tailored to your products, so please feel free to contact us.
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【Thermal Design Engineering Services】 Thermal fluid analysis of electronic devices involves challenges that differ from typical thermal fluid analysis, such as inputting difficult-to-judge conditions like heat generation, material properties, emissivity, and contact thermal resistance, as well as creating analysis models that consider actual heat dissipation paths. Our expert engineers conduct thermal simulations using FloTHERM on behalf of our clients and deliver analysis models and reports. Please use our services in the following situations: ↓ ↓ ↓ (1) I need the results of a thermal simulation immediately. (2) I want to determine the thermal resistance of components through thermal simulation. (3) I want to provide a thermal simulation model of semiconductor packages to my clients. (4) I want to verify the heat dissipation characteristics of a substrate. (5) I want to evaluate heat dissipation measures for a housing.
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■Improvement of reliability in automotive control systems ■Cooling technology for in-vehicle DVD players ■Thermal design for high performance of laptop enclosures ■Noise reduction of multimedia projectors through thermal fluid analysis ■Cooling technology for portable electronic devices through thermal fluid analysis ■Miniaturization of communication power supply devices using high-performance heat sinks ■Cooling technology for the world's fastest 1GHz ALPHA processor ■Significant reduction in development costs for communication equipment enclosures ■Reduction of development costs for power conversion devices ★There are many other applicable cases. Please feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We have formed partnerships with leading software vendors of the era to provide top-level digital engineering technologies in Japan, including solutions for thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions. We offer a comprehensive engineering environment necessary to solve the diverse and complex challenges faced by our customers. Official Blog: https://www.idaj.co.jp/blog/ IDAJ YouTube Channel: https://www.youtube.com/channel/UCGCd8pB5Lwq_noIoxpgJrrw/featured X: https://twitter.com/IDAJ_CAE Facebook: https://www.facebook.com/IDAJ.CAE
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