Reduce product costs with high-precision thermal property analysis! (Thermal simulation)
Are you increasing product costs to ensure product design reliability? If optimal thermal measures are not taken, excessive measures will reduce market competitiveness, while insufficient measures will increase development costs. However, by optimizing temperature margin design, total costs can be reduced (thermal simulation). Our unique method features localized heating of specific parts of the chip, with measurements taken at the PN junction (specific) within the heated area. Additionally, by constructing a simulation model that fits the measurement results, the entire system product can be temperature-predicted using simulation technology. We also offer consulting services, including the creation of libraries and the establishment of rules for heat dissipation measures and thermal management. For more details, please download the catalog or contact us.
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basic information
**Features** ○ High Precision → The uniform temperature state within the heating area can be confirmed. Measurements can be taken at specific PN junctions within the heating area, allowing for the maximum temperature to be obtained. Accurate ΔT can be determined. → Since no temperature rise areas outside the heating area are confirmed, power loss is unlikely to occur. ○ Thermal design can be implemented during upstream design → By preventing issues during development, development costs can be reduced. → Products can be supplied without market complaints. ○ Optimal heat dissipation design can be achieved → Product unit costs can be lowered. → Miniaturization is possible, increasing market competitiveness. ● For more details, please download the catalog or contact us.
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Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.