Uniform Plasma Sputtering Device

High-quality sputtering through uniform plasma confinement

The "Uniform Plasma Sputtering Device" adopts the so-called opposing target sputtering method. The conventional opposing target sputtering method utilizes the mirror magnetic field as it is, but it has been improved with the aim of sputtering while taking advantage of the characteristics of the mirror magnetic field. Utilizing the plasma confinement method with a mirror magnetic field for sputtering is very effective, as it does not require significant changes in its form for sputtering use; by placing two targets opposite each other, plasma can be efficiently confined between them. In contrast, plasma confinement methods using toroidal coils, such as the tokamak type, face difficulties when applied to sputtering, and currently, a form resembling a cross-section of a toroidal coil is typically used. In this case, drift occurs, and the plasma cannot be sufficiently confined, causing it to spread within the container. However, merely having a mirror magnetic field is advantageous for plasma confinement between targets when used for sputtering, but uniformity cannot be expected. Therefore, the Uniform Plasma Sputtering Device achieves both plasma confinement and uniformity.

Organic ELOther metal materials