ヤシマ Product Lineup

We would like to introduce our "Vacuum Deposition Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material, which is deposited onto a substrate positioned at a 90-degree angle to the target. Additionally, by preserving the magnetic moment in a gradually changing magnetic field, the kinetic energy of the component parallel to the magnetic field plus the kinetic energy of the component perpendicular to the magnetic field remains constant, causing charged particles to be reflected at both ends of the magnetic poles. 【Features】 ■ Low-temperature deposition ■ High vacuum sputtering ■ Unique sputtering technology (composition control of the film, uniform plasma) ■ Proprietary magnetron cathode *For more details, please download the PDF or feel free to contact us.

• Sputtering Equipment

We would like to introduce our "Opposing Target Sputtering Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material onto a substrate positioned at a 90-degree angle to the targets. This allows for high-speed reactive sputtering, such as for oxide films. 【Features】 ■ No damage to the substrate: Ultra-low temperature sputtering is possible ■ Confined plasma: Low impedance even in high vacuum ■ Reactive gases (such as O2) are difficult to enter the plasma: Enables high-speed reactive sputtering for oxide films and more *For more details, please download the PDF or feel free to contact us.

• Sputtering Equipment

The "Uniform Plasma Sputtering Device" adopts the so-called opposing target sputtering method. The conventional opposing target sputtering method utilizes the mirror magnetic field as it is, but it has been improved with the aim of sputtering while taking advantage of the characteristics of the mirror magnetic field. Utilizing the plasma confinement method with a mirror magnetic field for sputtering is very effective, as it does not require significant changes in its form for sputtering use; by placing two targets opposite each other, plasma can be efficiently confined between them. In contrast, plasma confinement methods using toroidal coils, such as the tokamak type, face difficulties when applied to sputtering, and currently, a form resembling a cross-section of a toroidal coil is typically used. In this case, drift occurs, and the plasma cannot be sufficiently confined, causing it to spread within the container. However, merely having a mirror magnetic field is advantageous for plasma confinement between targets when used for sputtering, but uniformity cannot be expected. Therefore, the Uniform Plasma Sputtering Device achieves both plasma confinement and uniformity.

• Other metal materials
• Organic EL

Our company has been involved in vacuum technology for over 30 years, providing products tailored to user specifications primarily to research institutions. We offer a wide range of vacuum deposition equipment, including the "RF Magnetron Sputtering System," which allows for dual gas introduction, and the "Compact Vacuum Evaporation System," which enables affordable and easy thin film production. Additionally, we have various research equipment available, such as "Vacuum Chambers" and "Turbo Vacuum Pumps." Please feel free to consult us when needed. 【Features】 <Vacuum Deposition Equipment> ■ Designed with consideration for the expandability of the system ■ Engineered to be an economical system ■ Supports target sizes from simple, compact models to those exceeding 1 meter ■ Proven track record across a wide range of fields from experimentation to production *For more details, please refer to the PDF materials or feel free to contact us.

• Evaporation Equipment
• Sputtering Equipment
• Vacuum Equipment

Electron beam deposition equipment is standard for vacuum deposition of high melting point materials. Our company supports not only our original deposition sources but also those from various manufacturers. We provide a high vacuum and ultra-high vacuum environment to stabilize the electron beam. We accommodate substrate heaters, rotation, and more. We support load lock specifications. We also accommodate manual/automatic operation via sequencer and touch panel.

• Evaporation Equipment

Container dimensions: φ150×200H, exhaust system: 2-inch diffusion pump (with LN2) + rotary pump 20L/min. A 2-inch size is used for the main valve to effectively utilize the pump's exhaust capacity. The metal parts of the vacuum container, main valve, three-way valve, and leak valve are made of stainless steel.

• Other surface treatment equipment

● Price: 5 million yen (including tax) ● φ3 inch target, 1 molybdenum cathode ● RF 300W power supply, with automatic matching box ● Gas system: 1 system (up to 3 systems available as an option), adjustable via mass flow controller ● Capable of sputtering insulators such as oxides. ● Option to install a substrate heater available. ● Simple structure that is easy to use while eliminating unnecessary components. ● Space-saving dimensions: 800W × 600L × 900H.

• Plasma surface treatment equipment
• Organic EL
• Sputtering Equipment

This is a viewport for vacuum use. It allows for the direct introduction of a glass window into the interior of the vacuum chamber. The window is made of plate glass, which minimizes distortion. The effective viewing area is approximately φ52 when using ICF114. Window material: Kovar glass.

• Glass

● Advanced technology for joining ceramics and all types of metals ● Excellent insulation properties using high-purity alumina ● Suitable for ultra-high vacuum applications ● Moreover, it is inexpensive

• Other physicochemical equipment