Electron beam deposition equipment for high melting point metals | Clean film formation with magnetic field deflection type
YEG-Series-
To the site troubled by film contamination of high melting point metals! With a magnetic field deflection mechanism and a zero oil exhaust system, we prevent the contamination of evaporated materials and form high-purity thin films.
The "YEG Series" electron beam evaporation device is a vacuum deposition system designed to prevent film formation defects caused by contamination from evaporated materials and the intrusion of oil vapor in the thin film formation process. It provides stable film quality through magnetic deflection beam control and dry exhaust using a turbo molecular pump (TMP), addressing issues such as "impurities mixing during the deposition of high melting point metals, leading to unstable film quality" in experimental and prototype environments. 【Recommended for these concerns】 ◆ Concerned about contamination from oil vapor from oil rotary pumps, etc. ◆ Materials mixing during the deposition of high melting point metals ◆ Limited space in the laboratory for large deposition equipment <Reasons for selection> - Maintains a clean vacuum environment free of oil vapor through TMP main exhaust - Capable of multilayer film deposition with support for both single and four-element switching hearths - Flexible response to the addition of load lock chambers and substrate heating mechanisms *For any questions regarding hearth capacity or custom specifications, please download the catalog or feel free to contact us. (We can also assist with inquiries about vacuum levels and deposition conditions.)
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basic information
Corresponding processes/scenes: - High-purity vacuum deposition processes for high melting point metals (such as tungsten and molybdenum) and various oxides - A multilayer and stacked film process using a multi-element to quaternary switching hearth for continuous film formation without breaking the vacuum - Upgrading from old deposition equipment using oil diffusion pumps to a dry vacuum and TMP exhaust system
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Applications/Examples of results
Application Areas and Work Examples: It is utilized in prototype and development lines in universities, research institutions, semiconductors, electronic components, optical thin films, and sensor development, where high melting point materials and compound materials are deposited. In particular, it excels in environments that require uniform film thickness control by combining substrate heating and rotation mechanisms, as well as in labs and clean rooms that want to maintain expandability for future load lock additions while facing spatial constraints.
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Company information
The necessity of thin film production in next-generation technologies is increasing more and more. In thin film production, there is a demand for technology that is low-temperature, dense, and also highly productive. Our company has made it possible to implement arc discharge measures that were not achievable with conventional opposing target sputtering methods, and we manufacture and sell uniform plasma sputtering devices that meet the above conditions.