Large area sputtering is possible! Film deposition can be achieved even without cooling.
We would like to introduce our "Vacuum Deposition Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material, which is deposited onto a substrate positioned at a 90-degree angle to the target. Additionally, by preserving the magnetic moment in a gradually changing magnetic field, the kinetic energy of the component parallel to the magnetic field plus the kinetic energy of the component perpendicular to the magnetic field remains constant, causing charged particles to be reflected at both ends of the magnetic poles. 【Features】 ■ Low-temperature deposition ■ High vacuum sputtering ■ Unique sputtering technology (composition control of the film, uniform plasma) ■ Proprietary magnetron cathode *For more details, please download the PDF or feel free to contact us.
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basic information
【Benefits of Utilization】 ■ Film deposition is possible without cooling ■ Dense film ■ Stable reactive sputtering (composition control) *For more details, please download the PDF or feel free to contact us.
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【For customers like this】 ■ Thin film manufacturing companies ■ Companies that manufacture thin films for resin films ■ Research institutes, etc. *For more details, please download the PDF or feel free to contact us.
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The necessity of thin film production in next-generation technologies is increasing more and more. In thin film production, there is a demand for technology that is low-temperature, dense, and also highly productive. Our company has made it possible to implement arc discharge measures that were not achievable with conventional opposing target sputtering methods, and we manufacture and sell uniform plasma sputtering devices that meet the above conditions.
